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AD4697BCBZ-RL7 - Analog Devices

Description: 16-Bit, 8-Channel, 500 kSPS, Easy Drive Multiplexed SAR ADC

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PCB Footprints
AD4697BCBZ-RL7 - Analog Devices PCB footprint - BGA - BGA - 36-Ball Wafer Level Chip Scale Package [WLCSP] (CB-36-5)
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3D Models
AD4697BCBZ-RL7 - Analog Devices  - 3D model - BGA - 36-Ball Wafer Level Chip Scale Package [WLCSP] (CB-36-5)
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AD4697BCBZ-RL7 Details

  • Manufacturer Part Number:

    AD4697BCBZ-RL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WLCSP-36

  • Pin Count:

    36

  • Manufacturer Package Code:

    CB-36

  • HTS Code:

    8542.39.00.30

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog Input Voltage-Max:

    2.6 V

  • Analog Input Voltage-Min:

    -2.4 V

  • Conversion Time-Max:

    0.415 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    S-PBGA-B36

  • Length:

    2.96 mm

  • Linearity Error-Max (EL):

    0.003815%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    8

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    36

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    SERIAL, PARALLEL, WORD

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA36,6X6,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Sample Rate:

    0.5 MHz

  • Seated Height-Max:

    0.56 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    2.96 mm

AD4697BCBZ-RL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the AD4697BCBZ-RL7 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing noise coupling between the analog and digital sections. It's also recommended to use a 4-layer PCB with a dedicated power plane and to follow the layout guidelines provided in the AD4697 evaluation board documentation.
  • To ensure accurate calibration of the AD4697BCBZ-RL7, it's essential to follow the calibration procedure outlined in the datasheet. This includes using a high-accuracy voltage reference, ensuring the device is in a stable thermal environment, and using a low-noise power supply. Additionally, it's recommended to perform calibration at multiple temperatures to account for temperature drift.
  • The maximum allowed input voltage range for the AD4697BCBZ-RL7 is ±10.5 V, which is the absolute maximum rating. However, the recommended input voltage range for optimal performance is ±5 V. Exceeding the maximum rating can damage the device.
  • To handle EMI and RFI interference when using the AD4697BCBZ-RL7, it's recommended to use proper shielding, grounding, and filtering techniques. This includes using a metal shield around the device, connecting the shield to the analog ground, and using ferrite beads or common-mode chokes to filter out high-frequency noise.
  • The typical power consumption of the AD4697BCBZ-RL7 is around 35 mW at a supply voltage of 5 V. However, this can vary depending on the specific application, operating frequency, and output load. It's recommended to consult the datasheet and evaluate the power consumption in the specific use case.

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AD4697BCBZ-RL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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