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AD7383-4BCPZ - Analog Devices

Description: Pseudo Differential Input, Quad, 4 MSPS Simultaneous Sampling, 16-Bit, SAR ADC

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AD7383-4BCPZ - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - CP-25
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AD7383-4BCPZ - Analog Devices  - 3D model - Quad Flat No-Lead - CP-25
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AD7383-4BCPZ Details

  • Manufacturer Part Number:

    AD7383-4BCPZ

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    LFCSP:LEADFRM CHIP SCALE

  • Package Description:

    LFCSP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    LFCSP:LEADFRM CHIP SCALE

  • ECCN Code:

    3A991.c.4

  • HTS Code:

    8542.39.00.30

  • Date Of Intro:

    2023-05-08

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog Input Voltage-Max:

    1.7 V

  • Analog Input Voltage-Min:

    -1.245 V

  • Conversion Time-Max:

    0.25 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    S-XQCC-N24

  • Length:

    4 mm

  • Linearity Error-Max (EL):

    0.0057983%

  • Moisture Sensitivity Level:

    3

  • Number of Analog In Channels:

    4

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    2'S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC24,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Sample Rate:

    4 MHz

  • Sample and Hold / Track and Hold:

    TRACK

  • Seated Height-Max:

    0.6 mm

  • Supply Current-Max:

    3.2 mA

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    4 mm

AD7383-4BCPZ Frequently Asked Questions (FAQs)

  • The recommended layout and routing for the AD7383-4BCPZ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the analog input traces. Additionally, it's recommended to use a 4-layer PCB with a dedicated analog power plane and a dedicated digital power plane. The datasheet provides a recommended layout and routing diagram, but it's also recommended to consult with Analog Devices' application notes and layout guidelines for more detailed information.
  • The AD7383-4BCPZ has an internal calibration circuit that can be used to calibrate the device. The calibration process involves applying a known input voltage to the device and then using the SPI interface to read the output code. The calibration data can then be used to correct for any offset and gain errors. The datasheet provides a detailed calibration procedure, and it's also recommended to consult with Analog Devices' application notes for more information on calibration and trimming techniques.
  • The maximum sampling rate of the AD7383-4BCPZ is 1.5 MSPS, and it can be achieved by using the device's internal clock or an external clock source. The power consumption of the device increases with the sampling rate, and it's recommended to consult with the datasheet and the power consumption calculator provided by Analog Devices to determine the power consumption at a given sampling rate.
  • The AD7383-4BCPZ has a SPI-compatible interface that can be used to communicate with a microcontroller or FPGA. The recommended communication protocol is the SPI protocol, and the datasheet provides a detailed description of the protocol and the required timing diagrams. Additionally, Analog Devices provides example code and interface diagrams for popular microcontrollers and FPGAs.
  • The AD7383-4BCPZ has a maximum junction temperature of 125°C, and it's recommended to keep the device's temperature below 85°C for optimal performance. The device's power consumption and thermal resistance can be used to estimate the junction temperature, and it's recommended to consult with the datasheet and Analog Devices' thermal management guidelines for more information on thermal management and heat sinking techniques.

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AD7383-4BCPZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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