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AD7685ARMZRL7 - Analog Devices

Description: Analog to Digital Converters - ADC 16-Bit, 250 kSPS PulSAR ADC in MSOP/QFN

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AD7685ARMZRL7 Details

  • Manufacturer Part Number:

    AD7685ARMZRL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    RM-10

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Input Voltage-Max:

    5.5 V

  • Conversion Time-Max:

    2.2 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.0092%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    1

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.25 MHz

  • Sample and Hold / Track and Hold:

    TRACK

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    5 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

AD7685ARMZRL7 Frequently Asked Questions (FAQs)

  • A good layout and routing practice is to keep the analog and digital grounds separate, use a solid ground plane, and keep the analog signal traces away from the digital signal traces. Additionally, use a low-ESR capacitor for the AVDD and DVDD pins, and keep the decoupling capacitors close to the pins.
  • The AD7685ARMZRL7 has an internal calibration circuit that can be enabled by setting the CAL bit in the control register. The device also has an internal voltage reference that can be calibrated using the VREFIN pin. It is recommended to follow the calibration procedure outlined in the datasheet to ensure accurate conversions.
  • The maximum sampling rate of the AD7685ARMZRL7 is 250 kSPS. However, the actual sampling rate may be limited by the system's clock frequency, the conversion time, and the settling time of the analog input signal.
  • The AD7685ARMZRL7 outputs 16-bit data in a twos-complement format. The output data can be read through the SPI interface, and the format of the output data is outlined in the datasheet. The output data can be processed and analyzed using a microcontroller or a digital signal processor.
  • The power consumption of the AD7685ARMZRL7 depends on the operating mode and the sampling rate. The typical power consumption is around 15 mW at 250 kSPS. To minimize power consumption, it is recommended to use the power-down mode when the device is not in use, and to optimize the system's clock frequency and voltage supply.

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AD7685ARMZRL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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