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AD7899BRZ-1 - Analog Devices

Description: AD7899BRZ-1, 14 bit ADC, Parallel, 28-Pin SOIC W

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AD7899BRZ-1 - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - R-28 (SOIC)
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AD7899BRZ-1 Details

  • Manufacturer Part Number:

    AD7899BRZ-1

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    RW-28

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Input Voltage-Max:

    10 V

  • Analog Input Voltage-Min:

    -10 V

  • Conversion Time-Max:

    2.2 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    17.9 mm

  • Linearity Error-Max (EL):

    0.0092%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    2

  • Number of Bits:

    14

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    2S COMPLEMENT BINARY

  • Output Format:

    PARALLEL, WORD

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP28,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.4 MHz

  • Sample and Hold / Track and Hold:

    TRACK

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

AD7899BRZ-1 Frequently Asked Questions (FAQs)

  • A good layout and routing practice is to keep the analog and digital grounds separate, use a star-ground configuration, and keep the analog signal traces away from the digital signal traces. Also, use a low-ESR capacitor for the VREF pin and a 0.1uF capacitor for the AVDD pin.
  • To ensure proper calibration, follow the calibration procedure outlined in the datasheet, which involves shorting the VIN+ and VIN- pins together and applying a known voltage to the REF pin. Also, make sure to use a high-precision voltage reference and a low-noise analog power supply.
  • The recommended power-up sequence is to apply the analog power supply (AVDD) first, followed by the digital power supply (DVDD), and then the clock signal. This ensures that the internal analog circuits are powered up before the digital circuits.
  • To handle the digital output data, use a first-in-first-out (FIFO) buffer or a double-buffered interface to ensure that the data is not corrupted or lost during transmission. Also, use a clock signal with a frequency that is at least 10 times the sampling frequency to ensure accurate data transfer.
  • The AD7899BRZ-1 has a maximum junction temperature of 150°C. To ensure reliable operation over temperature, use a heat sink or a thermal pad to dissipate heat, and ensure good airflow around the device. Also, follow the recommended operating conditions and derating guidelines outlined in the datasheet.

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AD7899BRZ-1 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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