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AD8320ARPZ - Analog Devices

Description: IC LINE DRIVER DGTL SER 20-SOIC

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PCB Footprints
AD8320ARPZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - RP Package 20-Lead Plastic TSSOP (4.4mm)
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3D Models
AD8320ARPZ - Analog Devices  - 3D model - Small Outline Packages - RP Package 20-Lead Plastic TSSOP (4.4mm)
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AD8320ARPZ Details

  • Manufacturer Part Number:

    AD8320ARPZ

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-20

  • Pin Count:

    20

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    5

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Supply Current-Max:

    105 mA

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

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AD8320ARPZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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