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AD9268BCPZ-125 - Analog Devices

Description: 16-Bit, 125 MSPS/105 MSPS/80 MSPS, 1.8 V Dual Analog-to-Digital Converter

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AD9268BCPZ-125 - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - CP-64-6
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AD9268BCPZ-125 - Analog Devices  - 3D model - Quad Flat No-Lead - CP-64-6
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AD9268BCPZ-125 Details

  • Manufacturer Part Number:

    AD9268BCPZ-125

  • Source Url Status Check Date:

    2013-05-01 14:56:30.48

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    9 X 9 MM, ROHS COMPLIANT, M0-220VMMD-4, LFCSP-64

  • Pin Count:

    64

  • Manufacturer Package Code:

    CP-64-6

  • Country Of Origin:

    Singapore

  • ECCN Code:

    3A001.A.5.A.5

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Input Voltage-Max:

    2 V

  • Conversion Time-Max:

    0.008 µs

  • Converter Type:

    ADC, FLASH METHOD

  • JESD-30 Code:

    S-XQCC-N64

  • JESD-609 Code:

    e3

  • Length:

    9 mm

  • Linearity Error-Max (EL):

    0.0084%

  • Moisture Sensitivity Level:

    3

  • Number of Analog In Channels:

    2

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    OFFSET BINARY, 2S COMPLEMENT BINARY, GRAY CODE

  • Output Format:

    PARALLEL, WORD

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC64,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    125 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    400 mA

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

AD9268BCPZ-125 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate analog and digital power plane is recommended. Keep the analog and digital signals separate and avoid crossing them over each other. Use a common mode filter and a ferrite bead to filter the power supply.
  • Use a low-jitter clock source (<100 ps) and a 50-ohm transmission line to drive the clock input. Ensure the clock signal is clean and free of noise. Use a clock buffer or a clock conditioner if necessary.
  • Power up the analog supply (AVDD) first, followed by the digital supply (DVDD). Ensure the analog supply is stable before applying the digital supply. Use a power-up sequence controller or a power management IC if necessary.
  • Use a DDR (Double Data Rate) interface to capture the output data. Ensure the FPGA or ASIC is configured to capture data on both the rising and falling edges of the clock. Use a data alignment circuit or a deserializer if necessary.
  • Perform a full-scale calibration after power-up. Use the CAL pin to initiate calibration. The device will automatically adjust its internal settings for optimal performance. Refer to the datasheet for specific calibration procedures.

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AD9268BCPZ-125 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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