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AD9371BBCZ-REEL - Analog Devices

Description: RF Transceiver Broad Market Mykonos Release

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AD9371BBCZ-REEL - Analog Devices - PCB symbol
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PCB Footprints
AD9371BBCZ-REEL - Analog Devices PCB footprint - BGA - BGA - BC-196-12
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3D Models
AD9371BBCZ-REEL - Analog Devices - 3D model - BGA - BC-196-12
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AD9371BBCZ-REEL Details

  • Manufacturer Part Number:

    AD9371BBCZ-REEL

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CSPBGA-196

  • Pin Count:

    196

  • Manufacturer Package Code:

    BC-196-12

  • Country Of Origin:

    South Korea

  • ECCN Code:

    5A991.B

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2016-07-22

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • JESD-30 Code:

    S-PBGA-B196

  • JESD-609 Code:

    e1

  • Length:

    12 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    196

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.27 mm

  • Supply Voltage-Nom:

    1.3 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    INTERFACE CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    12 mm

AD9371BBCZ-REEL Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a stack-up of signal-ground-power-ground-signal is recommended. The top layer should be used for signal routing, the second layer for ground, the third layer for power, and the bottom layer for signal routing again. This helps to minimize noise and ensure optimal performance.
  • To optimize power consumption, use the device's built-in power-saving features such as the low-power mode, reduce the sampling rate, and optimize the digital interface. Additionally, consider using a power management IC to regulate the voltage supply and reduce power consumption.
  • The recommended calibration procedure involves a two-step process. First, perform a coarse calibration to set the device's gain and offset. Then, perform a fine calibration to optimize the device's performance. Refer to the device's calibration guide for detailed instructions.
  • To ensure ESD protection, follow proper handling and storage procedures, use ESD-protective packaging, and implement ESD protection circuits on the PCB. Additionally, consider using ESD-protected components and connectors.
  • To manage thermal performance, use a heat sink or thermal pad on the device, ensure good airflow around the device, and use thermal interface materials to reduce thermal resistance. Additionally, consider using a thermal management IC to monitor and control the device's temperature.

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AD9371BBCZ-REEL Overview

Use the download button to access the AD9371BBCZ-REEL schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like AD937, or try a keyword search, such as Network Interfaces

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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