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AD9375BBCZ - Analog Devices

Description: RF Transceiver Mykonos+DPD Broad Market Release

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AD9375BBCZ - Analog Devices - PCB symbol
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PCB Footprints
AD9375BBCZ - Analog Devices PCB footprint - BGA - BGA - BC-196-12
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3D Models
AD9375BBCZ - Analog Devices - 3D model - BGA - BC-196-12
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AD9375BBCZ Details

  • Manufacturer Part Number:

    AD9375BBCZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CSP_BGA-196

  • Pin Count:

    196

  • Manufacturer Package Code:

    BC-196-12

  • Country Of Origin:

    South Korea

  • ECCN Code:

    5A991.G

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • JESD-30 Code:

    S-PBGA-B196

  • JESD-609 Code:

    e1

  • Length:

    12 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    196

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.27 mm

  • Supply Voltage-Nom:

    1.3 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    INTERFACE CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    12 mm

AD9375BBCZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a stack-up of signal-ground-power-ground-signal is recommended. Ensure that the RF traces are short and shielded, and that the power and ground planes are decoupled with capacitors.
  • Use the AD9375BBCZ's built-in calibration and optimization features, such as the internal calibration engine and the SPI interface. Additionally, consult the AD9375BBCZ's evaluation board documentation and Analog Devices' application notes for guidance on optimizing performance for specific applications.
  • The AD9375BBCZ has a maximum junction temperature of 125°C. Ensure good airflow around the device, and consider using a heat sink or thermal interface material to reduce thermal resistance. Monitor the device's temperature using the internal temperature sensor and adjust the system design accordingly.
  • Use proper shielding and grounding techniques, such as using a metal enclosure and connecting the device's exposed pads to ground. Ensure that the RF traces are routed away from digital signals and that the device is placed in a quiet zone on the PCB.
  • The AD9375BBCZ requires a 1.8V digital supply and a 3.3V analog supply. Ensure that the power supplies are clean and well-regulated, and that the device is powered up and down in a controlled manner to prevent damage.

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AD9375BBCZ Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like AD937, or try a keyword search, such as Network Interfaces

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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