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AD9625BBP-2.5 - Analog Devices

Description: Analog to Digital Converters - ADC 12 Bit 2.5Gsps ADC operating +/-1.2 , 3V

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AD9625BBP-2.5 - Analog Devices PCB footprint - BGA - BGA - (BP-196-2)--0
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AD9625BBP-2.5 - Analog Devices  - 3D model - BGA - (BP-196-2)--0
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AD9625BBP-2.5 Details

  • Manufacturer Part Number:

    AD9625BBP-2.5

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-196

  • Pin Count:

    196

  • Manufacturer Package Code:

    BP-196-2

  • Country Of Origin:

    South Korea

  • ECCN Code:

    3A001.A.5.A.3

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog Input Voltage-Max:

    1.2 V

  • Analog Input Voltage-Min:

    -1.2 V

  • Converter Type:

    ADC, PROPRIETARY METHOD

  • JESD-30 Code:

    S-PBGA-B196

  • Length:

    12 mm

  • Linearity Error-Max (EL):

    0.0513%

  • Moisture Sensitivity Level:

    3

  • Number of Analog In Channels:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    196

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    OFFSET BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HBGA

  • Package Equivalence Code:

    BGA196,14X14,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    240

  • Sample Rate:

    2.5 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    1.7 mm

  • Supply Voltage-Nom:

    1.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    12 mm

AD9625BBP-2.5 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate analog and digital power plane is recommended. Keep the analog and digital signals separate and avoid crossing them over each other. Use a common mode filter and a low-pass filter to reduce noise.
  • Use a low-jitter clock source (<100 ps) and a 50-ohm transmission line to drive the clock input. Ensure the clock signal is clean and free of noise. Use a clock buffer or a clock conditioner if necessary.
  • Power up the analog supply (AVDD) first, followed by the digital supply (DVDD), and then the clock input. Ensure the power supplies are stable before applying the clock signal.
  • Use a low-skew, high-speed interface (e.g., LVDS or CMOS) to transmit the output data. Ensure the receiving device can handle the data rate and format. Use a FIFO or a buffer to handle data overflow if necessary.
  • Use a heat sink or a thermal pad to dissipate heat. Ensure good airflow around the device. Keep the device away from heat sources and avoid blocking airflow. Monitor the device temperature and adjust the thermal management strategy accordingly.

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AD9625BBP-2.5 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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Part Image AD9625BBPZ-2.5 Analog Devices Inc

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