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AD9699BBPZ-3000 - Analog Devices

Description: 14 Bit Analog to Digital Converter 1 Input 1 Pipelined 196-BGA-ED (12x12)

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AD9699BBPZ-3000 - Analog Devices PCB footprint - BGA - BGA - 196-Ball Ball Grid Array, Thermally Enhanced [BGA_ED]
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AD9699BBPZ-3000 - Analog Devices  - 3D model - BGA - 196-Ball Ball Grid Array, Thermally Enhanced [BGA_ED]
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AD9699BBPZ-3000 Details

  • Manufacturer Part Number:

    AD9699BBPZ-3000

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HLFBGA-196

  • Pin Count:

    196

  • Manufacturer Package Code:

    BP-196-4

  • ECCN Code:

    3A991.c.3

  • HTS Code:

    8542.39.00.30

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog Input Voltage-Max:

    1.54 V

  • Analog Input Voltage-Min:

    -1.54 V

  • Converter Type:

    ADC, PROPRIETARY METHOD

  • JESD-30 Code:

    S-PBGA-B196

  • Length:

    12 mm

  • Linearity Error-Max (EL):

    0.11047%

  • Moisture Sensitivity Level:

    3

  • Number of Analog In Channels:

    1

  • Number of Bits:

    14

  • Number of Functions:

    1

  • Number of Terminals:

    196

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    OFFSET BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFBGA

  • Package Equivalence Code:

    BGA196,14X14,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    3000 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    1.53 mm

  • Supply Current-Max:

    408.5 mA

  • Supply Voltage-Nom:

    0.975 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    12 mm

AD9699BBPZ-3000 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate analog ground plane is recommended. Keep the analog and digital sections separate, and use a star-grounding scheme to minimize noise.
  • Use a low-jitter clock source (<100 ps) and ensure the clock signal is properly terminated. Use a clock frequency that is a multiple of the sampling frequency to minimize jitter. Also, consider using a clock buffer to reduce clock skew.
  • Power up the analog supply (AVDD) first, followed by the digital supply (DVDD), and finally the clock signal. Ensure that the power supplies are stable before applying the clock signal.
  • Use a FIFO or a buffer to handle the output data, and consider using a CRC or checksum to ensure data integrity. Also, ensure that the data is properly synchronized with the clock signal.
  • Use a heat sink or a thermal pad to dissipate heat. Ensure good airflow around the device, and consider using a thermal interface material to improve heat transfer.

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AD9699BBPZ-3000 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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