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ADAQ4003BBCZ-RL13 - Analog Devices

Description: 18-Bit, 2 MSPS, μModule Data Acquisition Solution

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ADAQ4003BBCZ-RL13 - Analog Devices PCB footprint - BGA - BGA - BC-49-5
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ADAQ4003BBCZ-RL13 - Analog Devices  - 3D model - BGA - BC-49-5
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ADAQ4003BBCZ-RL13 Details

  • Manufacturer Part Number:

    ADAQ4003BBCZ-RL13

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CSPBGA-49

  • Pin Count:

    49

  • Manufacturer Package Code:

    BC-49-5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2020-09-29

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog Input Voltage-Max:

    22.044 V

  • Analog Input Voltage-Min:

    -5.28 V

  • Conversion Time-Max:

    0.32 µs

  • Converter Type:

    DATA ACQUISITION DEVICE

  • JESD-30 Code:

    S-XBGA-B49

  • Length:

    7 mm

  • Linearity Error-Max (EL):

    0.0008%

  • Moisture Sensitivity Level:

    3

  • Number of Analog In Channels:

    1

  • Number of Bits:

    18

  • Number of Functions:

    1

  • Number of Terminals:

    49

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    2'S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA49,7X7,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    2 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    2.432 mm

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    HYBRID

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

ADAQ4003BBCZ-RL13 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate analog ground plane is recommended. Keep analog and digital traces separate, and use a common mode filter to reduce noise.
  • Use a thermocouple or RTD sensor with a high accuracy calibration, and ensure good thermal contact between the sensor and the device under test. Also, use a low-noise, low-impedance signal path to minimize errors.
  • The maximum sampling rate is 400 kSPS. To achieve this, use a high-speed clock source, ensure the analog input signal is properly filtered and amplified, and use the device's internal PGA to optimize the signal-to-noise ratio.
  • Use the device's power-down modes, reduce the clock frequency when not converting, and optimize the analog input signal to minimize the PGA gain. Also, use a low-power voltage regulator and consider using a heat sink or thermal pad to dissipate heat.
  • Use a SPI or I2C interface, depending on the microcontroller or FPGA's communication protocol. Ensure proper signal termination, use a level shifter if necessary, and consider using a FIFO or buffer to handle data transfer.

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ADAQ4003BBCZ-RL13 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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