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ADC08L060CIMTX/NOPB - Texas Instruments

Description: Analog to Digital Converters - ADC 8-Bit, 60-MSPS, Ultra-Low Power Analog-to-Digital Converter (ADC) 24-TSSOP -40 to 85

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ADC08L060CIMTX/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW (R-PDSO-G24)
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ADC08L060CIMTX/NOPB Details

  • Manufacturer Part Number:

    ADC08L060CIMTX/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-24

  • Pin Count:

    24

  • HTS Code:

    8542.39.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Peak-to-peak input voltage range(V) : 1.6

  • Analog Input Voltage-Max:

    1.6 V

  • Analog Input Voltage-Min:

    -1.6 V

  • Conversion Time-Max:

    0.016 µs

  • Converter Type:

    ADC, RESISTANCE LADDER

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    7.8 mm

  • Linearity Error-Max (EL):

    0.7422%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    BINARY

  • Output Format:

    PARALLEL, 8 BITS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP24,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    60 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    15.9 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

ADC08L060CIMTX/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a layout and routing guide in the application note SLAA523, which provides detailed recommendations for PCB layout, component placement, and routing to minimize noise and ensure optimal performance.
  • The clock signal should be a low-jitter, high-frequency clock (typically 10-20 MHz) with a 50% duty cycle. A clock buffer or a dedicated clock source is recommended to minimize jitter. Additionally, the clock signal should be routed close to the ADC and away from noisy signals.
  • A decoupling scheme with a combination of ceramic and electrolytic capacitors is recommended. A 0.1 μF ceramic capacitor should be placed close to the power pins, and a 10 μF electrolytic capacitor should be placed further away from the power pins. This scheme helps to filter out high-frequency noise and ensure stable power supply.
  • The ADC08L060CIMTX/NOPB has a parallel output interface that can be connected to a microcontroller or FPGA. The interface requires a minimum of 8-10 bits of data bus width, and the microcontroller or FPGA should be able to handle the data transfer rate of the ADC. Texas Instruments provides example code and interface guidelines in the datasheet and application notes.
  • The ADC08L060CIMTX/NOPB has a maximum junction temperature of 150°C. To ensure reliable operation, the device should be mounted on a PCB with a thermal pad, and a heat sink or thermal vias can be used to dissipate heat. The device should be operated within the recommended temperature range, and thermal monitoring is recommended to prevent overheating.

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ADC08L060CIMTX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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