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ADM2461EBRWZ-RL7 - Analog Devices

Description: 500 kbps, 5.7 kV RMS, Signal Isolated Half Duplex RS-485 Transceiver with ?15 kV IEC ESD

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ADM2461EBRWZ-RL7 - Analog Devices - PCB symbol
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ADM2461EBRWZ-RL7 - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - (RW-16)*
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3D Models
ADM2461EBRWZ-RL7 - Analog Devices - 3D model - Small Outline Packages - (RW-16)*
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ADM2461EBRWZ-RL7 Details

  • Manufacturer Part Number:

    ADM2461EBRWZ-RL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    RW-16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-485; EIA-422

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.002 A

  • Output Polarity:

    TRUE AND INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Receive Delay-Max:

    200 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    9 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.7 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Transmit Delay-Max:

    400 ns

  • Width:

    7.5 mm

ADM2461EBRWZ-RL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADM2461EBRWZ-RL7 should include a solid ground plane, short traces, and a decoupling capacitor (e.g., 0.1 μF) between VCC and GND. Additionally, keep the analog and digital traces separate and avoid running them parallel to each other.
  • To ensure reliable operation in high-temperature environments, make sure to follow the recommended operating temperature range (−40°C to +125°C) and consider the thermal resistance of the package (θJA = 30°C/W). Also, ensure good thermal conduction between the device and the PCB or a heat sink.
  • The ADM2461EBRWZ-RL7 can support data rates up to 100 Mbps, but the actual data rate may be limited by the specific application, cable length, and noise environment.
  • Yes, the ADM2461EBRWZ-RL7 can be used in a multi-point or multi-drop configuration, but it's essential to ensure that the total bus capacitance does not exceed the recommended maximum value (400 pF) to maintain signal integrity.
  • To troubleshoot issues with the ADM2461EBRWZ-RL7, use an oscilloscope to check the signal waveforms, verify the power supply and ground connections, and ensure that the device is properly terminated. Also, check the data transmission protocol and clock frequency to ensure they are within the recommended specifications.

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ADM2461EBRWZ-RL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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