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ADM2763EBRWZ - Analog Devices

Description: 5.7 kV RMS Isolated, High Working Voltage, RS-485 Transceiver with ?15 kV IEC ESD

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ADM2763EBRWZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - RW-16 (SOIC)
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ADM2763EBRWZ - Analog Devices  - 3D model - Small Outline Packages - RW-16 (SOIC)
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ADM2763EBRWZ Details

  • Manufacturer Part Number:

    ADM2763EBRWZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    RW-16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2020-06-18

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Differential Output:

    NO

  • Driver Number of Bits:

    1

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-485

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Characteristics:

    DIFFERENTIAL

  • Output Low Current-Max:

    0.001 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    200 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    8 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.7 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    400 ns

  • Width:

    7.5 mm

ADM2763EBRWZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADM2763EBRWZ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, using a shielded enclosure and keeping the cables away from the device can help minimize EMI.
  • To ensure proper power and decoupling, use a high-quality power supply with low ripple and noise, and decouple the device with a 10uF capacitor between VCC and GND, and a 100nF capacitor between AVCC and AGND. Additionally, use a 1uF capacitor between DVCC and DGND.
  • The maximum cable length for the ADM2763EBRWZ's RS-485 interface depends on the baud rate and cable quality. As a general rule, the maximum cable length is 4000 feet (1219 meters) at 9600bps, 1000 feet (305 meters) at 19200bps, and 500 feet (152 meters) at 38400bps.
  • To troubleshoot communication issues with the ADM2763EBRWZ, check the RS-485 termination, ensure the correct baud rate and data format, verify the device is properly powered and decoupled, and use a logic analyzer or oscilloscope to inspect the signal quality.
  • Yes, the ADM2763EBRWZ can be used in a hot-swappable application, but ensure that the power supply is properly sequenced and the device is properly reset during hot-swap events to prevent damage or malfunction.

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ADM2763EBRWZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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