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ADM560JRSZ-REEL - Analog Devices

Description: RS-232 Interface IC 3.3V N/BOOK RS-232 I/F IC

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ADM560JRSZ-REEL - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - RS-28 (SOIC)
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ADM560JRSZ-REEL - Analog Devices  - 3D model - Small Outline Packages - RS-28 (SOIC)
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ADM560JRSZ-REEL Details

  • Manufacturer Part Number:

    ADM560JRSZ-REEL

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Package Description:

    LEAD FREE, MO-150AH, SSOP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    RS-28

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Differential Output:

    NO

  • Driver Number of Bits:

    4

  • High Level Input Current-Max:

    0.00004 A

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232; TIA-232

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    10.2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    70 °C

  • Out Swing-Min:

    10 V

  • Output Characteristics:

    TOTEM-POLE

  • Output Low Current-Max:

    0.0016 A

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP28,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    2000 ns

  • Receiver Number of Bits:

    5

  • Seated Height-Max:

    2 mm

  • Supply Current-Max:

    3 mA

  • Supply Voltage-Max:

    3.63 V

  • Supply Voltage-Min:

    2.97 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.63 V

  • Supply Voltage1-Min:

    2.97 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Transmit Delay-Max:

    1000 ns

  • Width:

    5.3 mm

ADM560JRSZ-REEL Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADM560JRSZ-REEL involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the input traces. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure proper decoupling, place a 10uF capacitor between the VDD pin and the GND pin, and a 0.1uF capacitor between the AVDD pin and the AGND pin. Additionally, use a 10uF capacitor between the DVDD pin and the DGND pin.
  • The recommended input impedance for the ADM560JRSZ-REEL is 50 ohms. This ensures maximum power transfer and minimal signal reflection.
  • The ADM560JRSZ-REEL is rated for operation up to 125°C. However, it's recommended to derate the device's performance at high temperatures. Consult the datasheet for specific derating guidelines.
  • To troubleshoot issues with the ADM560JRSZ-REEL, start by verifying the power supply voltages, checking for proper decoupling, and ensuring the input signals are within the recommended range. Use an oscilloscope to inspect the input and output signals, and consult the datasheet for specific troubleshooting guidelines.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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