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ADM6328-23ARTZ-R7 - Analog Devices

Description: Ultralow Power, 3-Lead, Microprocessor Reset Circuits

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ADM6328-23ARTZ-R7 - Analog Devices PCB footprint - Other - Other - SOT95P237X112-3N
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ADM6328-23ARTZ-R7 - Analog Devices  - 3D model - Other - SOT95P237X112-3N
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ADM6328-23ARTZ-R7 Details

  • Manufacturer Part Number:

    ADM6328-23ARTZ-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    RT-3

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.12 mm

  • Supply Current-Max (Isup):

    0.00175 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.96 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.32V

  • Width:

    1.3 mm

ADM6328-23ARTZ-R7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADM6328-23ARTZ-R7 should minimize noise and ensure good thermal dissipation. Place the device near the power source, use a solid ground plane, and keep the input and output traces separate. Also, ensure that the thermal pad is connected to a solid ground plane or a heat sink.
  • Choose input and output capacitors with low ESR and high ripple current ratings. A 10uF to 22uF ceramic capacitor is recommended for the input, and a 10uF to 47uF ceramic capacitor is recommended for the output. The capacitor values may vary depending on the specific application and output current requirements.
  • The maximum ambient temperature for the ADM6328-23ARTZ-R7 is 85°C. However, the device can operate up to 125°C with derating. It's essential to ensure good thermal dissipation and follow the recommended PCB layout to prevent overheating.
  • Yes, the ADM6328-23ARTZ-R7 is designed to operate in high-vibration environments. However, it's essential to ensure that the device is properly mounted and secured to the PCB to prevent damage or dislodging. Follow the recommended PCB layout and mounting guidelines to ensure reliable operation.
  • To troubleshoot issues with the ADM6328-23ARTZ-R7, start by checking the input voltage, output voltage, and current. Verify that the device is properly connected and that the input and output capacitors are correctly sized. Check for signs of overheating, and ensure that the device is properly mounted and secured to the PCB. Consult the datasheet and application notes for more detailed troubleshooting guidelines.

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ADM6328-23ARTZ-R7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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