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ADR364BUJZ-R2 - Analog Devices

Description: V-Ref Precision 4.096V 5mA

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ADR364BUJZ-R2 - Analog Devices PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - UJ-5 (TSOT)_1
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ADR364BUJZ-R2 - Analog Devices  - 3D model - SOT23 (5-Pin) - UJ-5 (TSOT)_1
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ADR364BUJZ-R2 Details

  • Manufacturer Part Number:

    ADR364BUJZ-R2

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSOT

  • Package Description:

    ROHS COMPLIANT, MO-193AB, TSOT-5

  • Pin Count:

    5

  • Manufacturer Package Code:

    UJ-5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Analog IC - Other Type:

    THREE TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    4.1 V

  • Output Voltage-Min:

    4.092 V

  • Output Voltage-Nom:

    4.096 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    15 V

  • Supply Voltage-Min (Vsup):

    4.4 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temp Coef of Voltage-Max:

    9 ppm/°C

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Trim/Adjustable Output:

    YES

  • Voltage Tolerance-Max:

    0.1%

  • Width:

    1.6 mm

ADR364BUJZ-R2 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADR364BUJZ-R2 involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • The ADR364BUJZ-R2 is a calibrated device, but it's essential to follow the recommended calibration procedure outlined in the datasheet to ensure accurate voltage reference output. This involves shorting the CAL pin to VOUT and then to GND, and verifying the output voltage with a multimeter.
  • The maximum allowed power dissipation for the ADR364BUJZ-R2 is 440 mW. Exceeding this limit can cause the device to overheat, leading to reduced performance and lifespan. Ensure proper thermal design and heat sinking to maintain a safe operating temperature.
  • The ADR364BUJZ-R2 is rated for operation from -40°C to 125°C. While it can operate in high-temperature environments, the device's accuracy and stability may be affected. Ensure proper thermal design and consider using a thermally enhanced package or a heat sink to maintain a safe operating temperature.
  • To protect the ADR364BUJZ-R2 from EMI, use a shielded enclosure, keep the device away from high-frequency sources, and use a low-pass filter or ferrite bead on the input and output lines. Additionally, ensure good PCB layout practices, such as separating analog and digital traces, and using a solid ground plane.

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ADR364BUJZ-R2 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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