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ADS8317IBDGKT - Texas Instruments

Description: 16-Bit, Pseudo Bipolar, Fully Diff Input, 250kSPS Serial Out, 2.7V to 5.5V Micro Power Sampling ADC

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ADS8317IBDGKT Details

  • Manufacturer Part Number:

    ADS8317IBDGKT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Package Description:

    TSSOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China, Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Input Voltage-Max:

    2.5 V

  • Analog Input Voltage-Min:

    -1.25 V

  • Conversion Time-Max:

    666.7 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.0023%

  • Moisture Sensitivity Level:

    2

  • Number of Analog In Channels:

    1

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.25 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    3 mA

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

ADS8317IBDGKT Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 4-layer PCB with a solid ground plane, and to keep the analog and digital signals separate. The analog signals should be routed close to the ADC, and the digital signals should be routed away from the ADC. Additionally, the power and ground pins should be decoupled with 0.1uF and 10uF capacitors.
  • The ADS8317IBDGKT has an internal calibration circuit that can be used to calibrate the ADC. The calibration process involves applying a known input voltage and then reading the output code. The gain and offset errors can be calculated and corrected using the calibration data. Texas Instruments provides a calibration procedure in the datasheet and in application notes.
  • The maximum sampling rate of the ADS8317IBDGKT is 100kSPS. The power consumption of the ADC increases with the sampling rate. At 100kSPS, the power consumption is approximately 15mW. The power consumption can be reduced by reducing the sampling rate or by using the power-down mode.
  • The ADS8317IBDGKT has a serial interface that can be connected to a microcontroller or FPGA. The interface is compatible with SPI, QSPI, and MICROWIRE protocols. The ADC can be controlled and data can be read using the serial interface. Texas Instruments provides example code and interface diagrams in the datasheet and application notes.
  • The ADS8317IBDGKT has an operating temperature range of -40°C to 125°C. The performance of the ADC may be affected by temperature changes. The gain and offset errors may increase with temperature, and the conversion time may increase at lower temperatures. Texas Instruments provides temperature coefficients for the ADC in the datasheet.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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