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ADS8325IDGKT - Texas Instruments

Description: Texas Instruments ADS8325IDGKT, 16 bit Serial ADC, Differential Input, 8-Pin MSOP

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ADS8325IDGKT - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK
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ADS8325IDGKT Details

  • Manufacturer Part Number:

    ADS8325IDGKT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Package Description:

    TSSOP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Input Voltage-Max:

    5.5 V

  • Conversion Time-Max:

    666.7 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    S-PDSO-G8

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.0092%

  • Moisture Sensitivity Level:

    2

  • Number of Analog In Channels:

    1

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.1 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    1.5 mA

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Gold/Palladium/Silver (Ni/Au/Pd/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

ADS8325IDGKT Frequently Asked Questions (FAQs)

  • The ADS8325IDGKT requires careful PCB layout and routing to minimize noise and ensure accurate conversions. TI recommends using a 4-layer PCB with a solid ground plane, separating analog and digital signals, and using shielded cables for analog inputs. Additionally, decoupling capacitors should be placed close to the device, and the analog and digital power supplies should be separated.
  • To optimize the ADS8325IDGKT's performance, consider the following: choose the correct gain setting, adjust the sampling rate, and select the appropriate input range. Additionally, consider using the device's built-in calibration features, such as offset and gain calibration, to improve accuracy. Consult the datasheet and application notes for specific guidance.
  • The ADS8325IDGKT is rated for operation up to 125°C. However, high temperatures can affect the device's accuracy and reliability. At high temperatures, the device's offset and gain may drift, and the conversion rate may slow. Ensure proper thermal management, such as using heat sinks or thermal interfaces, and consider using temperature compensation techniques to maintain accuracy.
  • To ensure EMC, follow proper PCB design and layout practices, such as using a solid ground plane, separating analog and digital signals, and using shielded cables for analog inputs. Additionally, consider using electromagnetic interference (EMI) filters, such as common-mode chokes or ferrite beads, to reduce emissions and susceptibility.
  • The ADS8325IDGKT requires proper power sequencing to prevent damage or incorrect operation. Ensure that the analog power supply (AVDD) is powered up before the digital power supply (DVDD), and that the digital power supply is powered down before the analog power supply. Consult the datasheet for specific power sequencing requirements.

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ADS8325IDGKT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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