AE15-EW-S24 - CUI Inc.

AE15-EW-S24 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout and thermal management for optimal performance?
  CUI recommends a PCB layout with a solid ground plane and thermal vias to dissipate heat. A minimum of 2 oz copper thickness is recommended. Additionally, ensure a minimum of 1 mm clearance around the module to allow for airflow.
• How do I ensure electromagnetic compatibility (EMC) with the AE15-EW-S24?
  To ensure EMC, CUI recommends following proper PCB design and layout guidelines, using a metal enclosure, and implementing EMI filtering on the input and output lines. Additionally, the module should be installed in a way that minimizes radiation and conduction of electromagnetic interference.
• What is the derating curve for the AE15-EW-S24 at high temperatures?
  CUI provides a derating curve in the datasheet, which indicates the maximum output power at different temperatures. For temperatures above 50°C, the output power should be derated by 2.5% per degree Celsius to ensure reliable operation.
• Can I use the AE15-EW-S24 in a redundant or parallel configuration?
  Yes, the AE15-EW-S24 can be used in a redundant or parallel configuration to achieve higher power output or redundancy. However, CUI recommends consulting with their application engineers to ensure proper design and implementation.
• What is the MTBF (Mean Time Between Failures) of the AE15-EW-S24?
  CUI provides an MTBF of 1.5 million hours at 25°C, calculated according to MIL-HDBK-217F. This value is based on accelerated life testing and may vary depending on the application and operating conditions.