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AFE5801IRGCT - Texas Instruments

Description: 8-Channel VGA With Analog-to-Digital Converter (ADC)

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PCB Footprints
AFE5801IRGCT - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RGC0064H
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3D Models
AFE5801IRGCT - Texas Instruments  - 3D model - Quad Flat No-Lead - RGC0064H
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AFE5801IRGCT Details

  • Manufacturer Part Number:

    AFE5801IRGCT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    64

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO OPERATES ON 1.8V SUPPLY

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    S-XQCC-N64

  • JESD-609 Code:

    e4

  • Length:

    9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC64,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3.3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

AFE5801IRGCT Frequently Asked Questions (FAQs)

  • A good PCB layout for the AFE5801IRGCT involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. TI provides a recommended layout in the datasheet and application notes.
  • Optimizing the AFE5801IRGCT's performance involves selecting the right gain settings, filter configurations, and clock frequencies for your specific application. TI provides application notes and evaluation modules to help with this process.
  • To mitigate EMI and RFI, use a shielded enclosure, keep the device away from high-frequency sources, use a common-mode choke on the analog inputs, and ensure good PCB layout practices. TI provides guidelines for EMI and RFI mitigation in the datasheet and application notes.
  • To troubleshoot issues with the AFE5801IRGCT, start by verifying the power supply and clock signals, then check the analog input signals and filter settings. Use TI's evaluation modules and software tools to debug and analyze the device's behavior.
  • The AFE5801IRGCT has a maximum junction temperature of 150°C. Ensure good airflow, use a heat sink if necessary, and avoid blocking the thermal pads on the package. TI provides thermal management guidelines in the datasheet.

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AFE5801IRGCT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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