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AFE5803ZCF - Texas Instruments

Description: Fully Integrated, 8-Channel Ultrasound Analog Front End

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PCB Footprints
AFE5803ZCF - Texas Instruments PCB footprint - BGA - BGA - ZCF (R-PBGA-N135)
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AFE5803ZCF - Texas Instruments  - 3D model - BGA - ZCF (R-PBGA-N135)
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AFE5803ZCF Details

  • Manufacturer Part Number:

    AFE5803ZCF

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    135

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    IT ALSO REQUIRES 3.15 & 4.75 V FOR NORMAL OPERATION

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PBGA-B135

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    135

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.72 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3.15 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

AFE5803ZCF Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the AFE5803ZCF evaluation module documentation, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
  • The AFE5803ZCF has a programmable AFE, and the optimal settings depend on the specific application. TI provides a software development kit (SDK) that includes a graphical user interface (GUI) to configure the AFE settings, as well as example code and documentation to help optimize the settings for your application.
  • The AFE5803ZCF has a maximum data transfer rate of 160 MSPS (mega-samples per second) for the analog-to-digital converter (ADC) and 80 MSPS for the digital-to-analog converter (DAC). However, the actual data transfer rate may be limited by the system clock frequency and the specific application requirements.
  • To ensure EMC and EMI compliance, follow the recommended PCB layout and design guidelines provided by TI, use proper shielding and grounding techniques, and consider using EMI filters and shielding components in your design. Additionally, perform EMC and EMI testing to ensure compliance with relevant standards and regulations.
  • The AFE5803ZCF has a typical power consumption of 1.2 W at 1.8 V supply voltage. To optimize power consumption, use the power-down modes, adjust the clock frequency, and optimize the AFE settings for your specific application. Additionally, consider using power-saving features such as dynamic voltage and frequency scaling.

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AFE5803ZCF Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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