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AFGY120T65SPD - onsemi

Description: AEC Q101 qualified; Low Vcesat voltage; Tight parameter distribution; Soft recovery diode

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AFGY120T65SPD - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - AFGY120T65SPD-
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AFGY120T65SPD - onsemi  - 3D model - Transistor Outline, Vertical - AFGY120T65SPD-
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AFGY120T65SPD Details

  • Manufacturer Part Number:

    AFGY120T65SPD

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-247-3

  • Manufacturer Package Code:

    340CU

  • ECCN Code:

    EAR99

  • Date Of Intro:

    2020-01-28

  • Manufacturer:

    onsemi

  • YTEOL:

    5.35

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    160 A

  • Collector-Emitter Voltage-Max:

    650 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • Gate-Emitter Thr Voltage-Max:

    6.3 V

  • Gate-Emitter Voltage-Max:

    20 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    882 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • VCEsat-Max:

    2.05 V

AFGY120T65SPD Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or heat sink, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components.
  • To ensure reliable operation at high temperatures, ensure the device is operated within the recommended temperature range, use a heat sink or thermal pad, and consider using a thermal interface material to improve heat transfer.
  • The recommended soldering conditions for the AFGY120T65SPD are a peak temperature of 260°C, a dwell time of 10-30 seconds, and a soldering iron temperature of 350-370°C.
  • To handle ESD protection for the AFGY120T65SPD, use an ESD wrist strap or mat, handle the device by the body or pins, and avoid touching the pins or die.
  • Store the AFGY120T65SPD in a dry, cool place, away from direct sunlight and moisture. Handle the device by the body or pins, and avoid bending or flexing the leads.

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AFGY120T65SPD Overview

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