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AM2434BSFFHIALVR - Texas Instruments

Description: ARM Microcontrollers - MCU Quad-core Arm® Cortex®-R5F-based MCU with industrial communications and security up to 800 MHz 441-FCBGA -40 to 125

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AM2434BSFFHIALVR - Texas Instruments - PCB symbol
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PCB Footprints
AM2434BSFFHIALVR - Texas Instruments PCB footprint - BGA - BGA - ALV0441A
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3D Models
AM2434BSFFHIALVR - Texas Instruments - 3D model - BGA - ALV0441A
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AM2434BSFFHIALVR Details

  • Manufacturer Part Number:

    AM2434BSFFHIALVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Clock Frequency-Max:

    800 MHz

  • JESD-30 Code:

    S-PBGA-B441

  • Length:

    17.2 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    441

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HFBGA

  • Package Equivalence Code:

    BGA441,21X21,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Seated Height-Max:

    2.652 mm

  • Supply Voltage-Max:

    0.895 V

  • Supply Voltage-Min:

    0.81 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17.2 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

AM2434BSFFHIALVR Frequently Asked Questions (FAQs)

  • TI recommends a 4-layer PCB with a solid ground plane and thermal vias to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended for optimal thermal performance.
  • Ensure that the device is operated within the recommended voltage and current ranges, and that the PCB is designed to minimize thermal gradients. Also, consider using thermal interface materials to improve heat transfer.
  • Use a multi-layer PCB with a solid ground plane, and ensure that high-frequency signals are routed away from sensitive analog circuits. Also, consider using EMI filters and shielding to minimize radiation.
  • Use the device's power-saving features, such as dynamic voltage and frequency scaling, and optimize the system's clock frequency and voltage settings. Also, consider using low-power modes and shutdown modes when possible.
  • Perform thorough testing of the device's functionality, including voltage and current measurements, and validate the system's performance using tools like oscilloscopes and logic analyzers.

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AM2434BSFFHIALVR Overview

Use the download button to access the AM2434BSFFHIALVR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like AM243, or try a keyword search, such as Other uPs/uCs/Peripheral ICs

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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