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AM263P4ASOKFZCZRQ1 - Texas Instruments

Description: ARM® Cortex®-R4F Sitara™ Microcontroller IC 32-Bit Quad-Core 400MHz 256KB (256K x 8) FLASH 324-NFBGA (15x15)

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AM263P4ASOKFZCZRQ1 - Texas Instruments PCB footprint - BGA - BGA - ZCZ0324A
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AM263P4ASOKFZCZRQ1 - Texas Instruments  - 3D model - BGA - ZCZ0324A
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AM263P4ASOKFZCZRQ1 Details

  • Manufacturer Part Number:

    AM263P4ASOKFZCZRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Clock Frequency-Max:

    400 MHz

  • JESD-30 Code:

    S-PBGA-B324

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA324,18X18,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.4 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    15 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

AM263P4ASOKFZCZRQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout and thermal management guide in their application notes (e.g., SLUAAT96) and design guides (e.g., TIDA-01546). It's essential to follow these guidelines to ensure optimal performance, thermal dissipation, and reduced electromagnetic interference (EMI).
  • To minimize power consumption, configure the device to use the lowest possible clock frequency, disable unused peripherals, and use the power-saving features such as the Low-Dropout Regulator (LDO) and the Power-Saving Modes (PSM). Additionally, optimize the firmware to reduce CPU usage and implement power-gating techniques.
  • To ensure EMC and minimize EMI, follow the recommended PCB layout and design guidelines, use shielding and grounding techniques, and implement EMI filtering on the power supply and signal lines. Additionally, consider using a metal shield or a Faraday cage to enclose the device.
  • Use the Texas Instruments Code Composer Studio (CCS) integrated development environment (IDE) and the XDS110 debug probe to debug and troubleshoot issues. Additionally, consult the device's datasheet, user guides, and application notes for troubleshooting tips and guidelines.
  • To operate the device in harsh environments, ensure the PCB is designed with moisture-resistant and temperature-resistant components. Implement protective measures such as conformal coating, potting, or encapsulation to protect the device from environmental stressors. Consult the device's datasheet and application notes for specific guidelines on operating temperature, humidity, and vibration.

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AM263P4ASOKFZCZRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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