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AM6231ASGGGAALW - Texas Instruments

Description: Microprocessors - MPU Internet of Things (IoT) and gateway SoC with Arm Cortex-A53-based object and gesture recognition

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AM6231ASGGGAALW - Texas Instruments - PCB symbol
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PCB Footprints
AM6231ASGGGAALW - Texas Instruments PCB footprint - BGA - BGA - ALW0425A
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3D Models
AM6231ASGGGAALW - Texas Instruments - 3D model - BGA - ALW0425A
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AM6231ASGGGAALW Details

  • Manufacturer Part Number:

    AM6231ASGGGAALW

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.50

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • JESD-30 Code:

    S-PBGA-B425

  • Length:

    13 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    425

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA425,25X25,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Screening Level:

    ISO 26262

  • Seated Height-Max:

    0.89 mm

  • Speed:

    1400 MHz

  • Supply Voltage-Max:

    0.79 V

  • Supply Voltage-Min:

    0.715 V

  • Supply Voltage-Nom:

    0.75 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    13 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

AM6231ASGGGAALW Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 2-layer or 4-layer PCB with a solid ground plane and thermal vias to dissipate heat. A minimum of 2 oz copper thickness is recommended for the top and bottom layers.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended thermal design guidelines, use a heat sink if necessary, and ensure proper airflow around the device. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • The maximum allowed voltage on the input pins is 5.5V, which is the absolute maximum rating. However, it's recommended to keep the input voltage within the recommended operating range of 3.3V to 5V to ensure reliable operation.
  • Texas Instruments recommends using ESD protection devices, such as TVS diodes or ESD arrays, on the input and output pins to protect the device from electrostatic discharge. Additionally, follow proper handling and storage procedures to prevent ESD damage.
  • The recommended power-up sequence is to apply power to the VCC pin first, followed by the input signals. This ensures that the internal biasing and voltage regulators are properly initialized before the input signals are applied.

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AM6231ASGGGAALW Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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