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AM62A32AOMHIAMBR - Texas Instruments

Description: Microprocessors - MPU 1 TOPS vision SoC with RGB-IR ISP for 1-2 cameras, low-power, video surveillance, retail automation 484-FCBGA -40 to 105

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AM62A32AOMHIAMBR - Texas Instruments PCB footprint - BGA - BGA - AMB0484A
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AM62A32AOMHIAMBR - Texas Instruments  - 3D model - BGA - AMB0484A
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AM62A32AOMHIAMBR Details

  • Manufacturer Part Number:

    AM62A32AOMHIAMBR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.50

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • JESD-30 Code:

    S-PBGA-B484

  • Length:

    18 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HFBGA

  • Package Equivalence Code:

    BGA484,22X22,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Screening Level:

    AEC-Q100; ISO 26262-ASIL D

  • Seated Height-Max:

    2.556 mm

  • Supply Voltage-Max:

    0.79 V

  • Supply Voltage-Min:

    0.715 V

  • Supply Voltage-Nom:

    0.75 V

  • Surface Mount:

    YES

  • Technology:

    FinFET, 16 nm

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    18 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

AM62A32AOMHIAMBR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the AM62A32AOMHIAMBR datasheet, but it's essential to follow additional guidelines for optimal thermal performance. Ensure a solid ground plane, use thermal vias, and keep the PCB layer stack-up symmetrical to minimize thermal resistance.
  • The AM62A32AOMHIAMBR has multiple low-power modes, including Idle, Sleep, and Shutdown. To configure these modes, use the Power Management Interface (PMI) registers to control the power domains, clock gating, and voltage scaling. Refer to the device's technical reference manual for detailed instructions.
  • When using the internal voltage regulator (IVR), ensure that the input voltage is within the specified range, and the output voltage is set correctly using the IVR control registers. Also, be aware of the IVR's power sequencing requirements, and ensure that the system is properly powered up and down to avoid damage.
  • To optimize the AM62A32AOMHIAMBR's performance, analyze your application's requirements and adjust the device's configuration accordingly. This may involve tweaking the clock frequencies, adjusting the cache settings, and optimizing the memory hierarchy. Use the device's performance monitoring units (PMUs) to gather data and make informed decisions.
  • The AM62A32AOMHIAMBR has various security features, including secure boot, TrustZone, and cryptographic accelerators. To ensure the security of your system, follow the recommended security guidelines, use secure protocols for data transmission, and implement proper access control mechanisms.

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AM62A32AOMHIAMBR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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