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AMC1300BDWV - Texas Instruments

Description: ±250 mV-Input Reinforced Isolated Amplifier with High CMTI for Current Sensing

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AMC1300BDWV - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DWV0008A
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AMC1300BDWV - Texas Instruments  - 3D model - Small Outline Packages - DWV0008A
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AMC1300BDWV Details

  • Manufacturer Part Number:

    AMC1300BDWV

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2018-06-03

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    ISOLATION AMPLIFIER

  • Analog Input Voltage-Max:

    0.25 V

  • Analog Input Voltage-Min:

    -0.25 V

  • Bandwidth (3dB)-Nom:

    0.31 MHz

  • Common Mode Voltage-Max:

    3.4 V

  • Isolation Voltage-Min:

    1500 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    7.5 mm

  • Moisture Sensitivity Level:

    3

  • Non-linearity-Max:

    0.03%

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.45

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.8 mm

  • Supply Current-Max:

    9.8 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.85 mm

AMC1300BDWV Frequently Asked Questions (FAQs)

  • A good PCB layout for the AMC1300BDWV involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, using a 4-layer PCB with a dedicated power plane and a dedicated ground plane can help to reduce noise and improve performance.
  • To ensure proper calibration, follow the calibration procedure outlined in the datasheet, which involves applying a known input voltage and adjusting the internal offset and gain registers accordingly. Additionally, consider using an external calibration voltage source and a precision voltage reference to improve accuracy.
  • When selecting an external clock source for the AMC1300BDWV, consider the clock frequency, jitter, and phase noise requirements. A clock source with a frequency of 10-40 MHz is recommended, and the clock signal should have a low jitter and phase noise to ensure accurate conversion. Additionally, ensure the clock source is synchronized with the AMC1300BDWV's internal clock domain.
  • The AMC1300BDWV provides status flags and error indicators that can be used to detect and handle errors and exceptions. Implement a robust error handling mechanism in your firmware to detect and respond to these conditions, such as by resetting the device or taking corrective action to prevent data corruption.
  • The AMC1300BDWV is sensitive to temperature, so ensure good thermal management by providing adequate heat sinking, using a thermally conductive PCB material, and keeping the device away from heat sources. Additionally, consider using thermal interface materials and heat sinks to improve heat dissipation.

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AMC1300BDWV Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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