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AMC1301SDWV - Texas Instruments

Description: ±250 mV-Input Precision Reinforced Isolated Amplifier for Current Sensing

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AMC1301SDWV - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DWV Package 8-Pin SOIC
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AMC1301SDWV Details

  • Manufacturer Part Number:

    AMC1301SDWV

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2018-02-06

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    ISOLATION AMPLIFIER

  • Analog Input Voltage-Max:

    0.25 V

  • Analog Input Voltage-Min:

    -0.25 V

  • Bandwidth (3dB)-Nom:

    210 MHz

  • Common Mode Voltage-Max:

    1.49 V

  • Input Offset Voltage-Max:

    200 µV

  • Isolation Voltage-Min:

    1000 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    7.5 mm

  • Moisture Sensitivity Level:

    3

  • Non-linearity-Max:

    0.03%

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.45

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.8 mm

  • Supply Current-Max:

    8.3 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    0.21

  • Width:

    5.85 mm

AMC1301SDWV Frequently Asked Questions (FAQs)

  • A good PCB layout for the AMC1301SDWV involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, using a 4-layer PCB with a dedicated power plane and a dedicated ground plane can help to reduce noise and improve performance.
  • To ensure proper calibration, follow the calibration procedure outlined in the datasheet, which involves applying a known input voltage and adjusting the internal offset and gain registers accordingly. Additionally, consider using an external calibration voltage source and a precision voltage reference to improve accuracy.
  • When selecting external components, consider the operating frequency, signal amplitude, and impedance matching requirements. Choose resistors with low tolerance and temperature coefficient, and capacitors with low equivalent series resistance (ESR) and high reliability. Additionally, ensure that the components are rated for the operating voltage and temperature range of the AMC1301SDWV.
  • To troubleshoot issues with the AMC1301SDWV, start by verifying the power supply voltage, clock frequency, and input signal integrity. Check for noise sources, such as electromagnetic interference (EMI) or radio-frequency interference (RFI), and ensure proper grounding and shielding. Use an oscilloscope to visualize the input and output signals, and consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • To ensure reliable operation over temperature, consider the thermal management of the AMC1301SDWV. Use a heat sink or thermal pad to dissipate heat, and ensure good airflow around the device. Follow the recommended operating temperature range and avoid exceeding the maximum junction temperature. Additionally, consider using thermal interface materials and designing the PCB to minimize thermal resistance.

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AMC1301SDWV Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image AMC1301SDWVR Texas Instruments

Isolation Amplifier, 1 Func, 1000V Isolation-Min, 210MHz Band Width, CMOS, PDSO8