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AMC1302DWV - Texas Instruments

Description: Isolation Amplifiers +/-50mV-Input High-Precision Reinforced Isolated Amplifier for Current Sensing 8-SOIC -55 to 125

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AMC1302DWV - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DWV0008A
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AMC1302DWV - Texas Instruments  - 3D model - Small Outline Packages - DWV0008A
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AMC1302DWV Details

  • Manufacturer Part Number:

    AMC1302DWV

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2018-07-07

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    ISOLATION AMPLIFIER

  • Analog Input Voltage-Max:

    0.05 V

  • Analog Input Voltage-Min:

    -0.05 V

  • Bandwidth (3dB)-Nom:

    0.28 MHz

  • Common Mode Voltage-Max:

    3.3 V

  • Input Offset Voltage-Max:

    200 µV

  • Isolation Voltage-Min:

    1500 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    7.5 mm

  • Moisture Sensitivity Level:

    3

  • Non-linearity-Max:

    0.03%

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.8 mm

  • Supply Current-Max:

    10 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    0.28

  • Width:

    5.85 mm

AMC1302DWV Frequently Asked Questions (FAQs)

  • A good PCB layout for the AMC1302DWV involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, using a 4-layer PCB with a dedicated power plane and a dedicated ground plane can help reduce noise and improve performance.
  • To ensure proper calibration, follow the calibration procedure outlined in the datasheet, which involves applying a known input voltage and adjusting the internal offset and gain registers accordingly. It's also important to ensure the device is operated within its specified temperature range and that the input signals are within the recommended range.
  • When selecting external components for the AMC1302DWV, consider the device's operating frequency, input impedance, and output impedance. Choose resistors with low tolerance and temperature coefficients, and capacitors with low equivalent series resistance (ESR) and high reliability. Additionally, ensure the components are rated for the device's operating voltage and temperature range.
  • To troubleshoot issues with the AMC1302DWV, start by verifying the device's power supply and clock signals. Check for proper connections and signal integrity. Use an oscilloscope to verify the input signals and device outputs. Consult the datasheet and application notes for troubleshooting guides and common pitfalls to avoid.
  • To ensure reliable operation in high-temperature environments, follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow. The AMC1302DWV has a maximum junction temperature of 150°C, so ensure the device is operated within its specified temperature range.

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AMC1302DWV Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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