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AMC1311QDWVRQ1 - Texas Instruments

Description: Automotive High-Impedance, 2V Input, Reinforced Isolated Amplifier for Voltage Sensing

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AMC1311QDWVRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DWV Package 8-Pin SOIC
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AMC1311QDWVRQ1 - Texas Instruments  - 3D model - Small Outline Packages - DWV Package 8-Pin SOIC
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AMC1311QDWVRQ1 Details

  • Manufacturer Part Number:

    AMC1311QDWVRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    ISOLATION AMPLIFIER

  • Analog Input Voltage-Max:

    2 V

  • Analog Input Voltage-Min:

    -2 V

  • Bandwidth (3dB)-Nom:

    220 MHz

  • Common Mode Voltage-Max:

    1.49 V

  • Isolation Voltage-Min:

    1500 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    7.5 mm

  • Moisture Sensitivity Level:

    3

  • Non-linearity-Max:

    0.04%

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.8 mm

  • Subcategory:

    Isolation Amplifier

  • Supply Current-Max:

    10 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.85 mm

AMC1311QDWVRQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for the AMC1311QDWVRQ1 involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, using a 4-layer PCB with a dedicated power plane and a dedicated ground plane can help reduce noise and improve performance.
  • To ensure proper calibration, follow the calibration procedure outlined in the datasheet, which involves applying a known input voltage and adjusting the internal offset and gain registers accordingly. It's also important to ensure the device is operated within its specified temperature range and that the input signals are within the recommended range.
  • When selecting an external clock source for the AMC1311QDWVRQ1, consider the clock frequency, jitter, and phase noise. The clock frequency should be within the recommended range (typically 10-50 MHz), and the jitter should be minimized to ensure accurate conversions. Additionally, the clock source should be synchronized with the device's internal clock to prevent phase noise.
  • To handle overvoltage and undervoltage conditions, use external voltage regulators and overvoltage protection circuits to ensure the device operates within its recommended voltage range. Additionally, consider using a voltage supervisor or reset IC to monitor the voltage and reset the device if it falls outside the recommended range.
  • To ensure proper thermal management, ensure good airflow around the device, and consider using a heat sink or thermal pad to dissipate heat. The device's thermal pad should be connected to a solid ground plane to improve heat dissipation. Additionally, operate the device within its recommended temperature range to prevent overheating.

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AMC1311QDWVRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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