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AMC6821SDBQR - Texas Instruments

Description: 1 remote and local temp sensor with automatic fan speed control and fault detection

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AMC6821SDBQR - Texas Instruments - PCB symbol
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AMC6821SDBQR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DBQ0016A-SSOP
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AMC6821SDBQR - Texas Instruments - 3D model - Small Outline Packages - DBQ0016A-SSOP
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AMC6821SDBQR Details

  • Manufacturer Part Number:

    AMC6821SDBQR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    16

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    2 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

AMC6821SDBQR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • The AMC6821SDBQR can be configured using the TI Fusion Digital Power Designer software, which provides a graphical user interface to customize the device's settings and parameters for specific applications.
  • The input capacitor should have a low ESR and be rated for the maximum input voltage, while the output capacitor should have a low ESR and be rated for the maximum output current. The capacitor values should also be selected based on the specific application requirements.
  • Use an oscilloscope to monitor the input and output voltages, as well as the device's internal signals. Check the PCB layout and component selection to ensure they meet the recommended specifications. Consult the TI support resources and application notes for troubleshooting guides and FAQs.
  • The AMC6821SDBQR has a junction-to-case thermal resistance of 2.5°C/W. Ensure good thermal contact between the device and the heat sink or thermal pad. Use thermal interface materials and follow the recommended PCB layout guidelines to minimize thermal resistance.

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AMC6821SDBQR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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