AMPMGFB-50.0000T footprint, schematic symbol and 3D model by ABRACON

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AMPMGFB-50.0000T Details

Abracon recommends a symmetrical PCB layout with a solid ground plane to minimize noise and ensure optimal performance. A minimum of 2-3 vias under the device is recommended to connect the ground plane to the internal ground of the device.
Handle the device by the package body only, avoiding touching the pins or the quartz crystal. Use an anti-static wrist strap or mat to prevent electrostatic discharge (ESD) damage. Avoid bending or flexing the pins during assembly.
Abracon recommends a soldering profile with a peak temperature of 260°C (500°F) for a maximum of 10 seconds. The device should be soldered using a no-clean or water-soluble flux, and the soldering iron should be set to a temperature of 350°F (175°C) to 400°F (200°C).
The AMPMGFB-50.0000T is designed to operate in environments with moderate vibration. However, if the device will be subjected to high vibration (e.g., in an industrial or automotive application), Abracon recommends consulting with their application engineers to ensure the device can meet the specific requirements.
To troubleshoot issues with the device's frequency output, check the power supply voltage, ensure proper PCB layout and grounding, and verify that the device is properly soldered. If issues persist, consult Abracon's application notes and contact their technical support team for further assistance.

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Image	Part Number	Model
	AMPMGFB-50.0000T3 Abracon Corporation CMOS Output Clock Oscillator, 50MHz Nom
	AMPMGDB-50.0000 Abracon Corporation CMOS Output Clock Oscillator, 50MHz Nom
	AMPMGDB-50.0000T3 Abracon Corporation CMOS Output Clock Oscillator, 50MHz Nom
	AMPMGFB-50.0000 Abracon Corporation CMOS Output Clock Oscillator, 50MHz Nom
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