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AP2152AFGEG-7 - Diodes Incorporated

Description: 0.5A, 5.5V DUAL CHANNEL CURRENT-LIMITED POWER SWITCH WITH OUTPUT DISCHARGE

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PCB Footprints
AP2152AFGEG-7 - Diodes Incorporated PCB footprint - Other - Other -  U-DFN3030-8
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3D Models
AP2152AFGEG-7 - Diodes Incorporated  - 3D model - Other -  U-DFN3030-8
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AP2152AFGEG-7 Details

  • Manufacturer Part Number:

    AP2152AFGEG-7

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    GREEN, DFN-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.12,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.63 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

AP2152AFGEG-7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the AP2152AFGEG-7 should include a solid ground plane, wide power traces, and a thermal relief pattern under the IC. This helps to reduce thermal resistance and ensures efficient heat dissipation.
  • To ensure stability, it's essential to follow the recommended component values and PCB layout guidelines. Additionally, a minimum output capacitance of 10uF is recommended, and the output voltage should be decoupled with a 1uF ceramic capacitor.
  • Although the datasheet specifies a maximum input voltage of 5.5V, it's recommended to limit the input voltage to 5V to ensure reliable operation and prevent damage to the IC.
  • The AP2152AFGEG-7 is rated for operation up to 125°C. However, it's essential to consider the thermal derating curve and ensure that the IC does not exceed the maximum junction temperature (Tj) of 150°C.
  • The power dissipation can be calculated using the formula: Pd = (Vin - Vout) x Iout. The junction temperature can be estimated using the thermal resistance (RθJA) and the power dissipation: Tj = Ta + (RθJA x Pd).

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AP2152AFGEG-7 Overview

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