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AP2161FMG-7 - Diodes Incorporated

Description: DiodesZetex AP2161FMG-7, Dual Power Distribution Switch, Low Side, 110mΩ, 2.7 V min., 6-Pin UDFN2018

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PCB Footprints
AP2161FMG-7 - Diodes Incorporated PCB footprint - Small Outline No-lead - Small Outline No-lead - U-DFN2018-6
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3D Models
AP2161FMG-7 - Diodes Incorporated  - 3D model - Small Outline No-lead - U-DFN2018-6
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AP2161FMG-7 Details

  • Manufacturer Part Number:

    AP2161FMG-7

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    DFN-6

  • Pin Count:

    6

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Additional Feature:

    CURRENT LIMIT:1.9A; THERMAL SHUTDOWN:140C

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-N6

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.07,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.605 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +1.9V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.8 mm

AP2161FMG-7 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure stability and prevent oscillations in the output voltage, it's essential to follow the recommended component values and PCB layout guidelines. Additionally, a minimum output capacitance of 10uF is recommended, and the output capacitor's ESR should be less than 1 ohm.
  • Although the datasheet specifies a maximum input voltage of 18V, it's recommended to limit the input voltage to 15V to ensure reliable operation and prevent damage to the device.
  • While the AP2161FMG-7 is rated for operation up to 125°C, it's essential to consider the device's power dissipation and thermal management when operating in high-temperature environments. Ensure that the device is properly heatsinked, and the PCB is designed to dissipate heat efficiently.
  • The output voltage ripple and noise can be calculated using the formula: ΔVout = (Iout * ESR) / (f * Cout), where Iout is the output current, ESR is the output capacitor's equivalent series resistance, f is the switching frequency, and Cout is the output capacitance.

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