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AP2192AFGEG-7 - Diodes Incorporated

Description: Power Switch ICs - Power Distribution DUAL SWITCH 125mOhms 1.5A

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PCB Footprints
AP2192AFGEG-7 - Diodes Incorporated PCB footprint - Small Outline No-lead - Small Outline No-lead - U-DFN3030-8 (Type E)
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3D Models
AP2192AFGEG-7 - Diodes Incorporated  - 3D model - Small Outline No-lead - U-DFN3030-8 (Type E)
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AP2192AFGEG-7 Details

  • Manufacturer Part Number:

    AP2192AFGEG-7

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    3 X 3 MM, GREEN, DFN-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.12,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.63 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

AP2192AFGEG-7 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure the stability of the output voltage, it's essential to follow the recommended component values and PCB layout guidelines. Additionally, make sure to use a sufficient output capacitor with a low ESR value to minimize voltage ripple.
  • Although the datasheet specifies a maximum input voltage of 5.5V, it's recommended to limit the input voltage to 5V to ensure reliable operation and to prevent damage to the device.
  • While the AP2192AFGEG-7 is rated for operation up to 125°C, it's essential to consider the thermal derating curve and ensure that the device does not exceed the maximum junction temperature (Tj) of 150°C. Proper thermal design and heat sinking are crucial in high-temperature environments.
  • To troubleshoot issues with the AP2192AFGEG-7, start by verifying the input voltage, output voltage, and current consumption. Check for any signs of overheating, and ensure that the device is properly soldered and connected. If issues persist, consult the datasheet and application notes for guidance.

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AP2192AFGEG-7 Overview

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