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AP22814ASN-7 - Diodes Incorporated

Description: Power Switch ICs - Power Distribution Load Switch

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AP22814ASN-7 - Diodes Incorporated - PCB symbol
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PCB Footprints
AP22814ASN-7 - Diodes Incorporated PCB footprint - Other - Other - AP22814ASN-7-3
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3D Models
AP22814ASN-7 - Diodes Incorporated - 3D model - Other - AP22814ASN-7-3
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AP22814ASN-7 Details

  • Manufacturer Part Number:

    AP22814ASN-7

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DFN-6

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    S-PDSO-N6

  • Length:

    2 mm

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.08,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.6 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

AP22814ASN-7 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure the device is properly powered on and off, it is recommended to use a soft-start circuit to limit the inrush current during power-on, and to use a power sequencing circuit to ensure the device is powered off in the correct order.
  • When handling the device, precautions should be taken to prevent electrostatic discharge (ESD) damage. This includes using an ESD wrist strap or mat, and handling the device by the body rather than the pins.
  • To troubleshoot issues with the device, it is recommended to use a logic analyzer or oscilloscope to monitor the device's input and output signals, and to check the device's power supply and ground connections.
  • Thermal design considerations for this device include ensuring good airflow around the device, using a heat sink if necessary, and avoiding thermal hotspots on the PCB.

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AP22814ASN-7 Overview

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