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APA150-PQ208 - Microsemi Corporation

Description: FPGA ProASICPLUS Family 150K Gates 180MHz 0.22um Technology 2.5V 208-Pin PQFP

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APA150-PQ208 - Microsemi Corporation PCB footprint - Quad Flat Packages - Quad Flat Packages - PQ208
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APA150-PQ208 - Microsemi Corporation  - 3D model - Quad Flat Packages - PQ208
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APA150-PQ208 Details

  • Manufacturer Part Number:

    APA150-PQ208

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    0.50 MM PITCH, PLASTIC, QFP-208

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • YTEOL:

    0

  • Clock Frequency-Max:

    180 MHz

  • JESD-30 Code:

    S-PQFP-G208

  • JESD-609 Code:

    e0

  • Length:

    28 mm

  • Moisture Sensitivity Level:

    3

  • Number of Equivalent Gates:

    150000

  • Number of Inputs:

    158

  • Number of Logic Cells:

    6144

  • Number of Outputs:

    158

  • Number of Terminals:

    208

  • Operating Temperature-Max:

    70 °C

  • Organization:

    150000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FQFP

  • Package Equivalence Code:

    QFP208,1.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.1 mm

  • Supply Voltage-Max:

    2.7 V

  • Supply Voltage-Min:

    2.3 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    28 mm

APA150-PQ208 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 2 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
  • Use X7R or X5R ceramic capacitors with a voltage rating of 10-20% higher than the maximum input voltage. A minimum of 10uF input capacitance and 22uF output capacitance is recommended.
  • Use a systematic approach: 1) Verify input voltage and current, 2) Check output voltage and current, 3) Verify component temperatures, and 4) Consult the datasheet and application notes for guidance.
  • Use a shielded enclosure, keep sensitive components away from the APA150-PQ208, and ensure good PCB layout practices. Add EMI filters or common-mode chokes as needed.

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APA150-PQ208 Overview

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Part Image APA150-PQG208 Microsemi Corporation (now Microchip)

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Part Image APA150-PQG208I Microchip Technology Inc

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