APT50GF120LRG footprint, schematic symbol and 3D model by Microsemi Corporation

Symbol

PCB Footprints

3D Models

APT50GF120LRG Details

Microsemi recommends a 2-layer PCB with a solid ground plane on the bottom layer and a thermal pad on the top layer connected to the heat sink. Ensure a minimum of 1 oz copper thickness and use thermal vias to dissipate heat efficiently.
Implement a heat sink with a thermal resistance of ≤ 1°C/W, and ensure good airflow around the device. Also, consider derating the device's power handling capability according to the temperature derating curve provided in the datasheet.
Use a gate driver with a high current capability (e.g., ≥ 2A) and a low output impedance. Choose gate resistors with a value between 10 Ω to 22 Ω, and ensure the gate voltage is within the recommended range (15 V to 20 V).
Implement a voltage clamp or a transient voltage suppressor (TVS) to protect against overvoltage. Use a current sense resistor and a fast-acting fuse or a current limiter to prevent overcurrent conditions.
Handle the device with ESD-protective equipment and follow proper ESD handling procedures. Use an ESD-protected workstation and ensure the device is stored in an ESD-protective package when not in use.

Community Provided

System Verified

Community Approved

Use the download button to access the APT50GF120LRG schematic symbol, PCB footprint, and 3D model.

To find more CAD model downloads similar to this part, try a partial part number search, like APT50, or try a keyword search, such as IGBTs

If you searched for APT50GF120LRG, you might also be interested in these parts:

Showing 0 results

Image	Part Number	Model
	APT50GF120LR Microchip Technology Inc Insulated Gate Bipolar Transistor, 135A I(C), 1200V V(BR)CES, N-Channel, TO-264AA
For a full list of alternate parts for APT50GF120LRG, check out Findchips.com


Please enter a minimum 3 letters or numbers
← Prev Next →