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AS4C128M32MD2A-25BIN - Alliance Memory

Description: DRAM 4G 1.2V/1.8V 400MHz 128Mx32 Mobile DDR2

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PCB Footprints
AS4C128M32MD2A-25BIN - Alliance Memory PCB footprint - BGA - BGA - 134Ball FBGA(X32)
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3D Models
AS4C128M32MD2A-25BIN - Alliance Memory  - 3D model - BGA - 134Ball FBGA(X32)
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AS4C128M32MD2A-25BIN Details

  • Manufacturer Part Number:

    AS4C128M32MD2A-25BIN

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA-134

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.36

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Alliance Memory Inc

  • YTEOL:

    4

  • Access Mode:

    SINGLE BANK PAGE BURST

  • Additional Feature:

    AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY

  • Clock Frequency-Max (fCLK):

    400 MHz

  • I/O Type:

    COMMON

  • Interleaved Burst Length:

    4,8,16

  • JESD-30 Code:

    R-PBGA-B134

  • Length:

    11.5 mm

  • Memory Density:

    4294967296 bit

  • Memory IC Type:

    DDR2 DRAM

  • Memory Width:

    32

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    134

  • Number of Words:

    134217728 words

  • Number of Words Code:

    128000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128MX32

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA134,10X17,25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Refresh Cycles:

    8192

  • Seated Height-Max:

    1 mm

  • Self Refresh:

    YES

  • Sequential Burst Length:

    4,8,16

  • Standby Current-Max:

    0.001 A

  • Standby Voltage-Min:

    1.14 V

  • Supply Current-Max:

    0.3 mA

  • Supply Voltage-Max (Vsup):

    1.3 V

  • Supply Voltage-Min (Vsup):

    1.14 V

  • Supply Voltage-Nom (Vsup):

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    BOTTOM

  • Width:

    10 mm

AS4C128M32MD2A-25BIN Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the AS4C128M32MD2A-25BIN is 0°C to 70°C.
  • The AS4C128M32MD2A-25BIN requires a refresh cycle every 64ms, with a minimum of 8192 refreshes within an 64ms interval.
  • The AS4C128M32MD2A-25BIN supports a maximum clock frequency of 166MHz.
  • After power-up, the SDRAM must be initialized by sending a series of commands, including a PRECHARGE ALL command, an AUTOREFRESH command, and a MODE REGISTER SET command.
  • The AS4C128M32MD2A-25BIN has a latency of 3 clock cycles (CL3).

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AS4C128M32MD2A-25BIN Overview

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