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AS4C128M8D3LC-12BCN - Alliance Memory

Description: DRAM DDR3, 1G, 128M x 8, 1.35V, 78-ball BGA, 800MHz, (C-die), Commercial Temp - Tray

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AS4C128M8D3LC-12BCN Details

  • Manufacturer Part Number:

    AS4C128M8D3LC-12BCN

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VFBGA, BGA78,9X13,32

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.32

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Alliance Memory Inc

  • YTEOL:

    4

  • Access Mode:

    MULTI BANK PAGE BURST

  • Clock Frequency-Max (fCLK):

    800 MHz

  • I/O Type:

    COMMON

  • Interleaved Burst Length:

    4,8

  • JESD-30 Code:

    R-PBGA-B78

  • Length:

    10.5 mm

  • Memory Density:

    1073741824 bit

  • Memory IC Type:

    DDR3L DRAM

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    78

  • Number of Words:

    134217728 words

  • Number of Words Code:

    128000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    95 °C

  • Organization:

    128MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA78,9X13,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Refresh Cycles:

    8192

  • Seated Height-Max:

    1 mm

  • Self Refresh:

    YES

  • Sequential Burst Length:

    4,8

  • Standby Current-Max:

    0.015 A

  • Supply Current-Max:

    0.195 mA

  • Supply Voltage-Max (Vsup):

    1.45 V

  • Supply Voltage-Min (Vsup):

    1.283 V

  • Supply Voltage-Nom (Vsup):

    1.35 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    7.5 mm

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AS4C128M8D3LC-12BCN Overview

Use the download button to access the AS4C128M8D3LC-12BCN 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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