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AS4C16M32MSA-6BIN - Alliance Memory

Description: DRAM 512M 166MHz 16Mx32 Mobile LP SDRAM IT

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PCB Footprints
AS4C16M32MSA-6BIN - Alliance Memory PCB footprint - BGA - BGA - 90-ball FBGA
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3D Models
AS4C16M32MSA-6BIN - Alliance Memory  - 3D model - BGA - 90-ball FBGA
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AS4C16M32MSA-6BIN Details

  • Manufacturer Part Number:

    AS4C16M32MSA-6BIN

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA-90

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.28

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Alliance Memory Inc

  • YTEOL:

    4

  • Access Mode:

    FOUR BANK PAGE BURST

  • Access Time-Max:

    5.5 ns

  • Additional Feature:

    AUTO/SELF REFRESH

  • JESD-30 Code:

    R-PBGA-B90

  • Length:

    13 mm

  • Memory Density:

    536870912 bit

  • Memory IC Type:

    SYNCHRONOUS DRAM

  • Memory Width:

    32

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    90

  • Number of Words:

    16777216 words

  • Number of Words Code:

    16000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    16MX32

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    1 mm

  • Self Refresh:

    YES

  • Supply Voltage-Max (Vsup):

    1.95 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    8 mm

AS4C16M32MSA-6BIN Frequently Asked Questions (FAQs)

  • The AS4C16M32MSA-6BIN has an operating temperature range of 0°C to 70°C, and an extended temperature range of -40°C to 85°C for industrial grade.
  • To enter self-refresh mode, the device must be in the idle state, and then the SREF input must be driven low. The device will then enter self-refresh mode, and the clock can be stopped. To exit self-refresh mode, the SREF input must be driven high, and the clock must be restarted.
  • The AS4C16M32MSA-6BIN supports a maximum clock frequency of 166 MHz.
  • During power-up, the VDD and VDDQ pins must be powered up simultaneously, and the clock must be stable before applying any input signals. During power-down, the clock must be stopped, and the input signals must be held in a stable state before powering down the VDD and VDDQ pins.
  • The AS4C16M32MSA-6BIN has a latency of 6 clock cycles (CL6).

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AS4C16M32MSA-6BIN Overview

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