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AS4C16M32MSB-6BIN - Alliance Memory

Description: DRAM LPSDRAM, 512M, 16M X 32, 1.8V, 90 BALL, BGA 8X13MM, 166 MHZ, INDUSTRIAL TEMP, B Die

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PCB Footprints
AS4C16M32MSB-6BIN - Alliance Memory PCB footprint - BGA - BGA - 90-ball FBGA
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3D Models
AS4C16M32MSB-6BIN - Alliance Memory  - 3D model - BGA - 90-ball FBGA
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AS4C16M32MSB-6BIN Details

  • Manufacturer Part Number:

    AS4C16M32MSB-6BIN

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    FBGA-90

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.28

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Alliance Memory Inc

  • YTEOL:

    0

  • Access Mode:

    FOUR BANK PAGE BURST

  • Access Time-Max:

    5.5 ns

  • Additional Feature:

    AUTO/SELF REFRESH

  • Clock Frequency-Max (fCLK):

    166 MHz

  • I/O Type:

    COMMON

  • Interleaved Burst Length:

    1,2,4,8

  • JESD-30 Code:

    R-PBGA-B90

  • Length:

    13 mm

  • Memory Density:

    536870912 bit

  • Memory IC Type:

    SYNCHRONOUS DRAM

  • Memory Width:

    32

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    90

  • Number of Words:

    16777216 words

  • Number of Words Code:

    16000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    16MX32

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA90,9X15,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Refresh Cycles:

    8192

  • Seated Height-Max:

    1 mm

  • Self Refresh:

    YES

  • Sequential Burst Length:

    1,2,4,8,FP

  • Standby Current-Max:

    0.003 A

  • Supply Current-Max:

    0.075 mA

  • Supply Voltage-Max (Vsup):

    1.95 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    8 mm

AS4C16M32MSB-6BIN Frequently Asked Questions (FAQs)

  • The AS4C16M32MSB-6BIN has an operating temperature range of 0°C to 70°C, and an extended temperature range of -40°C to 85°C for industrial grade.
  • The AS4C16M32MSB-6BIN requires a refresh cycle every 64ms, with a minimum of 4096 refresh cycles within an 64ms interval. The refresh command should be issued when the device is in the idle state.
  • The AS4C16M32MSB-6BIN supports a maximum clock frequency of 166MHz, with a corresponding data transfer rate of 333MB/s.
  • After power-up, the AS4C16M32MSB-6BIN requires a power-on reset sequence, followed by a mode register set (MRS) command to set the operating mode, and finally a precharge command to prepare the device for operation.
  • The AS4C16M32MSB-6BIN has a latency of 6 clock cycles for read operations and 2 clock cycles for write operations.

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