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AS4C1G16D4-062BIN - Alliance Memory

Description: DRAM DDR4, 16Gb, 1G x 16, 1.2v, 96-ball FBGA, 1600MHz, Industrial

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PCB Footprints
AS4C1G16D4-062BIN - Alliance Memory PCB footprint - BGA - BGA - 96-Ball FBGA – x16 (KH)
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3D Models
AS4C1G16D4-062BIN - Alliance Memory  - 3D model - BGA - 96-Ball FBGA – x16 (KH)
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AS4C1G16D4-062BIN Details

  • Manufacturer Part Number:

    AS4C1G16D4-062BIN

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FBGA-96

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.36

  • Manufacturer:

    Alliance Memory Inc

  • YTEOL:

    0

  • Access Mode:

    MULTI BANK PAGE BURST

  • Additional Feature:

    AUTO/SELF REFRESH

  • Clock Frequency-Max (fCLK):

    1600 MHz

  • I/O Type:

    COMMON

  • Interleaved Burst Length:

    4,8

  • JESD-30 Code:

    R-PBGA-B96

  • Length:

    13 mm

  • Memory Density:

    17179869184 bit

  • Memory IC Type:

    DDR4 DRAM

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    96

  • Number of Words:

    1073741824 words

  • Number of Words Code:

    1000000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1GX16

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA96,9X16,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Refresh Cycles:

    8192

  • Seated Height-Max:

    1.2 mm

  • Self Refresh:

    YES

  • Sequential Burst Length:

    4,8

  • Standby Current-Max:

    43 A

  • Supply Current-Max:

    0.299 mA

  • Supply Voltage-Max (Vsup):

    1.26 V

  • Supply Voltage-Min (Vsup):

    1.14 V

  • Supply Voltage-Nom (Vsup):

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    9 mm

AS4C1G16D4-062BIN Frequently Asked Questions (FAQs)

  • The AS4C1G16D4-062BIN has an industrial temperature range of -40°C to 85°C, making it suitable for use in a wide range of applications.
  • To ensure data integrity, it's essential to follow the power-up and power-down sequences outlined in the datasheet, including the recommended voltage ramp rates and timing.
  • The recommended refresh rate for the AS4C1G16D4-062BIN is 4096 refresh cycles every 64ms, as specified in the JEDEC standard for DDR SDRAM.
  • The AS4C1G16D4-062BIN is designed to operate at a voltage supply of 1.8V, but it's essential to check the datasheet for specific voltage tolerance and derating information before using it in a system with a different voltage supply.
  • The AS4C1G16D4-062BIN has built-in error detection and correction mechanisms, such as ECC and parity checking. It's essential to implement error handling and exception routines in your system design to ensure reliable operation.

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