Part Image

AS4C1G8D4-75BIN - Alliance Memory

Description: DRAM

Download AS4C1G8D4-75BIN Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
AS4C1G8D4-75BIN - Alliance Memory PCB footprint - BGA - BGA - AS4C1G8D4-75BIN
click to zoom
3D Models
AS4C1G8D4-75BIN - Alliance Memory  - 3D model - BGA - AS4C1G8D4-75BIN
click to zoom

AS4C1G8D4-75BIN Details

  • Manufacturer Part Number:

    AS4C1G8D4-75BIN

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.36

  • Manufacturer:

    Alliance Memory Inc

  • YTEOL:

    0

  • Access Mode:

    MULTI BANK PAGE BURST

  • Additional Feature:

    AUTO/SELF REFRESH

  • Clock Frequency-Max (fCLK):

    1333 MHz

  • I/O Type:

    COMMON

  • Interleaved Burst Length:

    4,8

  • JESD-30 Code:

    R-PBGA-B78

  • Length:

    12 mm

  • Memory Density:

    8589934592 bit

  • Memory IC Type:

    DDR4 DRAM

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    78

  • Number of Words:

    1073741824 words

  • Number of Words Code:

    1000000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    95 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1GX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA78,9X13,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    1.2 mm

  • Self Refresh:

    YES

  • Sequential Burst Length:

    4,8

  • Standby Current-Max:

    0.04 A

  • Supply Current-Max:

    0.32 mA

  • Supply Voltage-Max (Vsup):

    1.26 V

  • Supply Voltage-Min (Vsup):

    1.14 V

  • Supply Voltage-Nom (Vsup):

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    7.5 mm

AS4C1G8D4-75BIN Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the AS4C1G8D4-75BIN is 0°C to 85°C.
  • Yes, the AS4C1G8D4-75BIN is RoHS (Restriction of Hazardous Substances) compliant, meaning it meets the European Union's directive on the restriction of certain hazardous substances in electrical and electronic equipment.
  • The refresh interval for the AS4C1G8D4-75BIN is 7.8us (microseconds) at a temperature range of 0°C to 85°C.
  • Yes, the AS4C1G8D4-75BIN is designed to operate at a supply voltage of 3.3V ± 0.3V, making it suitable for use in 3.3V systems.
  • The minimum clock cycle time for the AS4C1G8D4-75BIN is 7.5ns (nanoseconds) at a clock frequency of 133MHz.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

AS4C1G8D4-75BIN Overview

Use the download button to access the AS4C1G8D4-75BIN schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like AS4C1, or try a keyword search, such as DRAMs

Parts related to AS4C1G8D4-75BIN

Showing 0 results