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AS4C256M16D4A-75BIN - Alliance Memory

Description: DRAM DDR4, 4G, 256 X 16, 1.2V, 96-Ball FBGA, 1333MHZ, Industrial Temp - Tray

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PCB Footprints
AS4C256M16D4A-75BIN - Alliance Memory PCB footprint - BGA - BGA - 96-Ball FBGA Package 7.5x13x1.2mm(max)_2025
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3D Models
AS4C256M16D4A-75BIN - Alliance Memory  - 3D model - BGA - 96-Ball FBGA Package 7.5x13x1.2mm(max)_2025
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AS4C256M16D4A-75BIN Details

  • Manufacturer Part Number:

    AS4C256M16D4A-75BIN

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TFBGA, BGA96,9X16,32

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.36

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Alliance Memory Inc

  • YTEOL:

    5.1

  • Access Mode:

    MULTI BANK PAGE BURST

  • Clock Frequency-Max (fCLK):

    1333 MHz

  • I/O Type:

    COMMON

  • Interleaved Burst Length:

    8

  • JESD-30 Code:

    R-PBGA-B96

  • Length:

    13 mm

  • Memory Density:

    4294967296 bit

  • Memory IC Type:

    DDR4 DRAM

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    96

  • Number of Words:

    268435456 words

  • Number of Words Code:

    256000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    95 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256MX16

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA96,9X16,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Refresh Cycles:

    8192

  • Seated Height-Max:

    1.2 mm

  • Self Refresh:

    YES

  • Sequential Burst Length:

    8

  • Standby Current-Max:

    0.036 A

  • Supply Current-Max:

    0.223 mA

  • Supply Voltage-Max (Vsup):

    1.26 V

  • Supply Voltage-Min (Vsup):

    1.14 V

  • Supply Voltage-Nom (Vsup):

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    7.5 mm

AS4C256M16D4A-75BIN Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the AS4C256M16D4A-75BIN is 0°C to 70°C.
  • Yes, the AS4C256M16D4A-75BIN is RoHS (Restriction of Hazardous Substances) compliant, meaning it meets the European Union's directive on the restriction of certain hazardous substances in electrical and electronic equipment.
  • The refresh rate of the AS4C256M16D4A-75BIN is 3.9 μs at 75 MHz, which is a typical refresh rate for SDRAM modules of this type.
  • Yes, the AS4C256M16D4A-75BIN is designed to operate at a supply voltage of 3.3V, making it suitable for use in 3.3V systems.
  • The latency of the AS4C256M16D4A-75BIN is 4 clock cycles, which is a typical latency for SDRAM modules of this type.

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AS4C256M16D4A-75BIN Overview

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