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AS4C2G16D4-62BCN - Alliance Memory

Description: SDRAM - DDR4 Memory IC 32Gbit Parallel 1.6 GHz 13.75 ns 96-FBGA (7.5x13)

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AS4C2G16D4-62BCN - Alliance Memory PCB footprint - BGA - BGA - 96-Ball FBGA_2025
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AS4C2G16D4-62BCN - Alliance Memory  - 3D model - BGA - 96-Ball FBGA_2025
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AS4C2G16D4-62BCN Details

  • Manufacturer Part Number:

    AS4C2G16D4-62BCN

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA-96

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.36

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Alliance Memory Inc

  • YTEOL:

    5

  • Access Mode:

    MULTI BANK PAGE BURST

  • Additional Feature:

    SELF REFRESH

  • Clock Frequency-Max (fCLK):

    1600 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PBGA-B96

  • Length:

    13 mm

  • Memory Density:

    34359738368 bit

  • Memory IC Type:

    DDR4 DRAM

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    96

  • Number of Words:

    2147483648 words

  • Number of Words Code:

    2000000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    95 °C

  • Organization:

    2GX16

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA96,9X16,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Refresh Cycles:

    8192

  • Seated Height-Max:

    1.2 mm

  • Self Refresh:

    YES

  • Supply Voltage-Max (Vsup):

    1.26 V

  • Supply Voltage-Min (Vsup):

    1.14 V

  • Supply Voltage-Nom (Vsup):

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Bismuth/Copper/Nickel (Sn/Ag/Bi/Cu/Ni)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    7.5 mm

AS4C2G16D4-62BCN Frequently Asked Questions (FAQs)

  • The AS4C2G16D4-62BCN has an industrial temperature range of -40°C to 85°C, making it suitable for a wide range of applications.
  • To ensure signal integrity and reduce noise, use controlled impedance PCB traces, add decoupling capacitors, and consider using series resistors or terminations on the clock and data lines.
  • The recommended refresh rate for the AS4C2G16D4-62BCN is 4096 refresh cycles every 64ms, as specified in the JEDEC standard for DDR2 SDRAM.
  • No, the AS4C2G16D4-62BCN is a DDR2 SDRAM and is not compatible with DDR3 systems. It has a different voltage, signal timing, and pinout than DDR3 SDRAMs.
  • Follow the power-up and power-down sequencing guidelines specified in the datasheet, ensuring that VDD and VDDQ are powered up and down simultaneously, and that the clock signal is stable before applying commands.

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AS4C2G16D4-62BCN Overview

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