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AS4C32M16D3-12BIN - Alliance Memory

Description: DRAM DDR3, 512Mb, 32M x 16, 1.5V, 96-ball FBGA, 800 MHz, Industrial Temp - Tray

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AS4C32M16D3-12BIN - Alliance Memory  - 3D model
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AS4C32M16D3-12BIN Details

  • Manufacturer Part Number:

    AS4C32M16D3-12BIN

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.28

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2017-09-29

  • Manufacturer:

    Alliance Memory Inc

  • YTEOL:

    4

  • Access Mode:

    MULTI BANK PAGE BURST

  • Additional Feature:

    AUTO/SELF REFRESH

  • Clock Frequency-Max (fCLK):

    800 MHz

  • I/O Type:

    COMMON

  • Interleaved Burst Length:

    4,8

  • JESD-30 Code:

    R-PBGA-B96

  • Length:

    13 mm

  • Memory Density:

    536870912 bit

  • Memory IC Type:

    DDR3 DRAM

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    96

  • Number of Words:

    33554432 words

  • Number of Words Code:

    32000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    32MX16

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA96,9X16,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Refresh Cycles:

    8192

  • Seated Height-Max:

    1 mm

  • Self Refresh:

    YES

  • Sequential Burst Length:

    4,8

  • Standby Current-Max:

    0.012 A

  • Standby Voltage-Min:

    1.425 V

  • Supply Current-Max:

    0.195 mA

  • Supply Voltage-Max (Vsup):

    1.575 V

  • Supply Voltage-Min (Vsup):

    1.425 V

  • Supply Voltage-Nom (Vsup):

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    8 mm

AS4C32M16D3-12BIN Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the AS4C32M16D3-12BIN is 0°C to 70°C (commercial grade) and -40°C to 85°C (industrial grade).
  • The AS4C32M16D3-12BIN requires a refresh cycle every 64ms (tREF) to maintain data integrity. You can use a refresh counter to keep track of the refresh cycles and issue an AUTO REFRESH command (CBR) to refresh the entire memory array.
  • The AS4C32M16D3-12BIN supports a maximum clock frequency of 166MHz.
  • During power-up, apply power to VDD and VDDQ simultaneously, and then wait for at least 200us before applying a clock signal. During power-down, remove the clock signal and then power down VDD and VDDQ simultaneously.
  • The AS4C32M16D3-12BIN has a latency of 3 clock cycles (CL3) for read and write operations.

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AS4C32M16D3-12BIN Overview

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