Part Image

AS4C32M16SB-7BIN - Alliance Memory

Description: DRAM SDR, 512Mb, 32M x 16, 3.3V, 54-ball FBGA, 143MHz, Industrial Temp, B Die

Download AS4C32M16SB-7BIN Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
AS4C32M16SB-7BIN - Alliance Memory PCB footprint - BGA - BGA - 54 Ball FBGA Package 8 x 8 x 1.2mm
click to zoom
3D Models
AS4C32M16SB-7BIN - Alliance Memory  - 3D model - BGA - 54 Ball FBGA Package 8 x 8 x 1.2mm
click to zoom

AS4C32M16SB-7BIN Details

  • Manufacturer Part Number:

    AS4C32M16SB-7BIN

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.28

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2020-03-11

  • Manufacturer:

    Alliance Memory Inc

  • YTEOL:

    4

  • Access Mode:

    FOUR BANK PAGE BURST

  • Access Time-Max:

    5.4 ns

  • Clock Frequency-Max (fCLK):

    143 MHz

  • I/O Type:

    COMMON/SEPARATE

  • Interleaved Burst Length:

    1,2,4,8

  • JESD-30 Code:

    S-PBGA-B54

  • Length:

    8 mm

  • Memory Density:

    536870912 bit

  • Memory IC Type:

    SYNCHRONOUS DRAM

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    54

  • Number of Words:

    33554432 words

  • Number of Words Code:

    32000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    32MX16

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA54,9X9,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Refresh Cycles:

    8192

  • Seated Height-Max:

    1.2 mm

  • Self Refresh:

    YES

  • Sequential Burst Length:

    1,2,4,8,FP

  • Standby Current-Max:

    0.008 A

  • Standby Voltage-Min:

    3 V

  • Supply Current-Max:

    0.12 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.0Ag3.0Cu1.0)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    8 mm

AS4C32M16SB-7BIN Frequently Asked Questions (FAQs)

  • The AS4C32M16SB-7BIN has an operating temperature range of 0°C to 70°C.
  • The AS4C32M16SB-7BIN requires a refresh cycle every 64ms, with a minimum of 4096 refreshes within an 64ms interval.
  • The AS4C32M16SB-7BIN supports a maximum clock frequency of 143MHz.
  • After power-up, the AS4C32M16SB-7BIN requires a minimum of 200us delay before applying clock signals, followed by a minimum of 8 clock cycles of NOP commands, and then a MODE REGISTER SET command to set the operating mode.
  • The AS4C32M16SB-7BIN has a latency of 7 clock cycles (CL7).

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

AS4C32M16SB-7BIN Overview

Use the download button to access the AS4C32M16SB-7BIN schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like AS4C3, or try a keyword search, such as DRAMs

Parts related to AS4C32M16SB-7BIN

Showing 0 results

AS4C32M16SB-7BIN Alternates

Showing results

Image Part Number Model
Part Image AS4C32M16SB-7BINTR Alliance Memory Inc

Synchronous DRAM, 32MX16, 5.4ns, CMOS, PBGA54