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AS4C512M8D4-75BCN - Alliance Memory

Description: DRAM

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AS4C512M8D4-75BCN - Alliance Memory PCB footprint - BGA - BGA - 78-Ball FBGA Package 7.5x10.6x1.2mm(max)+
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AS4C512M8D4-75BCN - Alliance Memory  - 3D model - BGA - 78-Ball FBGA Package 7.5x10.6x1.2mm(max)+
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AS4C512M8D4-75BCN Details

  • Manufacturer Part Number:

    AS4C512M8D4-75BCN

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA-78

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.36

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2019-09-09

  • Manufacturer:

    Alliance Memory Inc

  • YTEOL:

    5.1

  • Access Mode:

    MULTI BANK PAGE BURST

  • Additional Feature:

    AUTO/SELF REFRESH

  • Clock Frequency-Max (fCLK):

    1333 MHz

  • I/O Type:

    COMMON

  • Interleaved Burst Length:

    8

  • JESD-30 Code:

    R-PBGA-B78

  • Length:

    10.6 mm

  • Memory Density:

    4294967296 bit

  • Memory IC Type:

    DDR4 DRAM

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    78

  • Number of Words:

    536870912 words

  • Number of Words Code:

    512000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    95 °C

  • Organization:

    512MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA78,9X13,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Refresh Cycles:

    8192

  • Seated Height-Max:

    1.2 mm

  • Self Refresh:

    YES

  • Sequential Burst Length:

    8

  • Standby Current-Max:

    0.044 A

  • Supply Current-Max:

    0.196 mA

  • Supply Voltage-Max (Vsup):

    1.26 V

  • Supply Voltage-Min (Vsup):

    1.14 V

  • Supply Voltage-Nom (Vsup):

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    7.5 mm

AS4C512M8D4-75BCN Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the AS4C512M8D4-75BCN is 0°C to 70°C (commercial grade) and -40°C to 85°C (industrial grade).
  • The AS4C512M8D4-75BCN requires a refresh cycle every 64ms (tREF) to maintain data integrity. You can use a refresh counter to keep track of the refresh cycles and issue an AUTO REFRESH command (CBR) to refresh the entire memory array.
  • The AS4C512M8D4-75BCN supports a maximum clock frequency of 166MHz.
  • During power-up, apply power to VDD and VDDQ simultaneously, and then apply a clock signal. During power-down, remove the clock signal and then power down VDD and VDDQ simultaneously. Refer to the datasheet for specific power-up and power-down sequences.
  • The AS4C512M8D4-75BCN has a latency of 5 clock cycles (CL5) for read and write operations.

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AS4C512M8D4-75BCN Overview

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